Patent Assignment Details
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Reel/Frame: | 012870/0081 | |
| Pages: | 6 |
| | Recorded: | 05/06/2002 | | |
Conveyance: | CORRECTIVE RECORDING TO CORRECT THE ASSIGNOR,S NAME PREVIOUSLY RECORDED ON REEL 010465 FRAME 0787. ASSIGNOR HEREBY CONFIRM THE ASSIGNMENT OF THE ENTIRE INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/06/2003
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Application #:
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09461287
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Filing Dt:
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12/15/1999
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Title:
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SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MOLD DIE
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Assignee
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7-12, TORANOMON 1-CHOME |
MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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RABIN & BERDO, P.C.
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STEVEN M. RABIN
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1101 14TH STREET N.W., - SUITE 500
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WASHINGTON, D.C. 20005
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