Total properties:
26
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Patent #:
|
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Issue Dt:
|
01/15/2002
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Application #:
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08208586
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Filing Dt:
|
03/11/1994
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Title:
|
PREFABRICATED SEMICONDUCTOR CHIP CARRIER
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|
|
Patent #:
|
|
Issue Dt:
|
10/13/1998
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Application #:
|
08465146
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Filing Dt:
|
06/05/1995
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Title:
|
METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP CARRIER
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|
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Patent #:
|
|
Issue Dt:
|
10/20/1998
|
Application #:
|
08482000
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Filing Dt:
|
06/07/1995
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Title:
|
LOW PROFILE SEMICONDUCTOR DIE CARRIER
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|
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Patent #:
|
|
Issue Dt:
|
10/13/1998
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Application #:
|
08902032
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Filing Dt:
|
07/29/1997
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Title:
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SEMICONDUCTOR DIE CARRIER HAVING A DIELECTRIC EPOXY BETWEEN ADJACENT LEADS
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|
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Patent #:
|
|
Issue Dt:
|
11/07/2000
|
Application #:
|
09178650
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Filing Dt:
|
10/26/1998
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Title:
|
APPARATUS FOR AND METHOD OF MANUFACTURING A SEMICONDUCTOR DIE CARRIER
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|
|
Patent #:
|
|
Issue Dt:
|
10/23/2001
|
Application #:
|
09218180
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Filing Dt:
|
12/22/1998
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Title:
|
OPEN-CAVITY SEMICONDUCTOR DIE PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
10/23/2001
|
Application #:
|
09249300
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Filing Dt:
|
02/12/1999
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Title:
|
INTEGRATED CONNECTOR AND SEMICONDUCTOR DIE PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
02/22/2005
|
Application #:
|
09705710
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Filing Dt:
|
11/06/2000
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Title:
|
APPARATUS FOR AND METHOD OF MANUFACTURING A SEMICONDUCTOR DIE CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2006
|
Application #:
|
09946554
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Filing Dt:
|
09/06/2001
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Publication #:
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|
Pub Dt:
|
03/06/2003
| | | | |
Title:
|
HERMETIC SEAL
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2002
|
Application #:
|
09950702
|
Filing Dt:
|
09/13/2001
|
Publication #:
|
|
Pub Dt:
|
01/24/2002
| | | | |
Title:
|
OPEN-CAVITY SEMICONDUCTOR DIE PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/07/2004
|
Application #:
|
09964542
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Filing Dt:
|
09/28/2001
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Publication #:
|
|
Pub Dt:
|
05/09/2002
| | | | |
Title:
|
PREFABRICATED SEMICONDUCTOR CHIP CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
09/28/2004
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Application #:
|
09978772
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Filing Dt:
|
10/18/2001
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Title:
|
DIE PACKAGE FOR CONNECTION TO A SUBSTRATE
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|
|
Patent #:
|
|
Issue Dt:
|
03/23/2004
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Application #:
|
10231347
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Filing Dt:
|
08/30/2002
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Publication #:
|
|
Pub Dt:
|
01/02/2003
| | | | |
Title:
|
OPEN-CAVITY SEMICONDUCTOR DIE PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
12/20/2005
|
Application #:
|
10755414
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Filing Dt:
|
01/13/2004
|
Publication #:
|
|
Pub Dt:
|
07/22/2004
| | | | |
Title:
|
PREFABRICATED SEMICONDUCTOR CHIP CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2005
|
Application #:
|
10767309
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Filing Dt:
|
01/29/2004
|
Publication #:
|
|
Pub Dt:
|
09/23/2004
| | | | |
Title:
|
PACKAGE FOR INTEGRATED CIRCUIT DIE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/07/2007
|
Application #:
|
10878000
|
Filing Dt:
|
06/29/2004
|
Publication #:
|
|
Pub Dt:
|
11/25/2004
| | | | |
Title:
|
DIE PACKAGE FOR CONNECTION TO A SUBSTRATE
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10920643
|
Filing Dt:
|
08/18/2004
|
Publication #:
|
|
Pub Dt:
|
01/27/2005
| | | | |
Title:
|
Methods for enclosing a thermoplastic package
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2006
|
Application #:
|
10920660
|
Filing Dt:
|
08/18/2004
|
Publication #:
|
|
Pub Dt:
|
01/20/2005
| | | | |
Title:
|
FLANGE FOR INTEGRATED CIRCUIT PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2010
|
Application #:
|
10920857
|
Filing Dt:
|
08/18/2004
|
Publication #:
|
|
Pub Dt:
|
01/20/2005
| | | | |
Title:
|
THERMOPLASTIC MATERIAL
|
|
|
Patent #:
|
|
Issue Dt:
|
09/28/2010
|
Application #:
|
11146856
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Filing Dt:
|
06/07/2005
|
Publication #:
|
|
Pub Dt:
|
12/03/2009
| | | | |
Title:
|
ULTRA HIGH-TEMPERATURE PLASTIC PACKAGE AND METHOD OF MANUFACTURE
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11366941
|
Filing Dt:
|
03/02/2006
|
Publication #:
|
|
Pub Dt:
|
03/29/2007
| | | | |
Title:
|
Packaged microphone with electrically coupled lid
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11875130
|
Filing Dt:
|
10/19/2007
|
Publication #:
|
|
Pub Dt:
|
06/26/2008
| | | | |
Title:
|
LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11983791
|
Filing Dt:
|
11/09/2007
|
Publication #:
|
|
Pub Dt:
|
05/15/2008
| | | | |
Title:
|
Led reflective package
|
|
|
Patent #:
|
|
Issue Dt:
|
03/16/2010
|
Application #:
|
11983813
|
Filing Dt:
|
11/09/2007
|
Publication #:
|
|
Pub Dt:
|
06/05/2008
| | | | |
Title:
|
MICROCIRCUIT PACKAGE HAVING DUCTILE LAYER
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12001792
|
Filing Dt:
|
12/12/2007
|
Publication #:
|
|
Pub Dt:
|
06/26/2008
| | | | |
Title:
|
Plastic electronic component package
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12220543
|
Filing Dt:
|
07/25/2008
|
Publication #:
|
|
Pub Dt:
|
12/11/2008
| | | | |
Title:
|
Plastic electronic component package
|
|