Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 064397/0082 | |
| Pages: | 3 |
| | Recorded: | 07/27/2023 | | |
Attorney Dkt #: | 2208002US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18226782
|
Filing Dt:
|
07/27/2023
|
Publication #:
|
|
Pub Dt:
|
02/08/2024
| | | | |
Title:
|
CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME
|
|
Assignee
|
|
|
NO. 18, NORTH FIRST ROAD, K.E.P.Z. |
KAOHSIUNG, TAIWAN |
|
Correspondence name and address
|
|
FEI-HUNG YANG
|
|
3196 MARIGOLD CIRCLE
|
|
DIAMOND BAR, CA 91765
|
Search Results as of:
06/18/2024 12:59 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|