Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 022032/0083 | |
| Pages: | 4 |
| | Recorded: | 12/29/2008 | | |
Attorney Dkt #: | BUR920080199US1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/23/2014
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Application #:
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12344711
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Filing Dt:
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12/29/2008
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Publication #:
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Pub Dt:
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07/01/2010
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Title:
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Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices
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Assignee
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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GREENBLUM & BERNSTEIN, P.L.C.
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1950 ROLAND CLARK DRIVE
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RESTON, VA 20191
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