Patent Assignment Details
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| Reel/Frame: | 057640/0084 | |
| Pages: | 3 |
| | Recorded: | 09/29/2021 | | |
| Attorney Dkt #: | 251979-1021 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17488503
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Filing Dt:
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09/29/2021
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Publication #:
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Pub Dt:
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01/20/2022
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Title:
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WAFER-BONDING STRUCTURE AND METHOD OF FORMING THEREOF
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Assignee
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| 1623 BUCKEYE DR. |
| MILPITAS, CALIFORNIA 95035 |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK, LLP
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280 INTERSTATE NORTH CIRCLE
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SUITE 550
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ATLANTA, GA 30339
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06/03/2024 04:47 PM
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