Patent Assignment Details
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| Reel/Frame: | 018196/0085 | |
| Pages: | 7 |
| | Recorded: | 08/31/2006 | | |
| Attorney Dkt #: | 4922-003 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/05/2011
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Application #:
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11457400
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Filing Dt:
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07/13/2006
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Title:
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METHOD FOR MANUFACTURING 3D CIRCUITS FROM BARE DIE OR PACKAGED IC CHIPS BY MICRODISPENSED INTERCONNECTIONS
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Assignee
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| 2100 NORTH ALAFAYA TRAIL, STE. 200 |
| ORLANDO, FLORIDA 32826 |
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Correspondence name and address
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MARY M. LEE
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1300 E. 9TH STREET, NO. 4
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EDMOND, OK 73034-5760
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