Patent Assignment Details
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| Reel/Frame: | 007393/0086 | |
| Pages: | 5 |
| | Recorded: | 02/10/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/18/1997
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Application #:
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08386644
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Filing Dt:
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02/10/1995
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Title:
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MULTI-LAYER ELECTRICAL INTERCONNECTION STRUCTURES AND FABRICATION METHODS
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Assignee
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| 2805 E. COLUMBIA ROAD BOISE, ID 83706 |
| BOISE,, IDAHO |
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Correspondence name and address
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MARK S. MATKIN
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WELLS, ST. JOHN, ROBERTS, GREGORY ET AL.
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W. 601 MAIN, SUITE 815
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SPOKANE, WA 99201
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