Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 024470/0086 | |
| Pages: | 2 |
| | Recorded: | 06/02/2010 | | |
| Attorney Dkt #: | T5057-R136U |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/28/2011
|
Application #:
|
12791978
|
Filing Dt:
|
06/02/2010
|
|
Publication #:
|
|
Pub Dt:
|
04/28/2011
| | | | |
|
Title:
|
THROUGH SILICON VIA WITH DUMMY STRUCTURE AND METHOD FOR FORMING THE SAME
|
|
|
Assignee
|
|
|
|
|
| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
|
|
Correspondence name and address
|
| |
LOWE HAUPTMAN HAM & BERNER, LLP (TSMC)
|
| |
1700 DIAGONAL ROAD, SUITE 300
|
| |
ALEXANDRIA, VA 22314
|
Search Results as of:
10/31/2024 08:59 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
