Patent Assignment Details
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Reel/Frame: | 028191/0087 | |
| Pages: | 2 |
| | Recorded: | 05/10/2012 | | |
Attorney Dkt #: | 7845-101D1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13468862
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Filing Dt:
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05/10/2012
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Publication #:
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Pub Dt:
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08/30/2012
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Title:
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MULTI-CHIP MODULE PACKAGE
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Assignee
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8F, NO. 205-3, SEC. 3, BEISHIN ROAD |
SHIN-DIAN CITY |
TAIWAN, TAIWAN |
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Correspondence name and address
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BERLINER & ASSOCIATES
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555 WEST FIFTH STREET
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31ST FLOOR
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LOS ANGELES, CA 90013
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