Patent Assignment Details
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| Reel/Frame: | 060618/0089 | |
| Pages: | 3 |
| | Recorded: | 07/08/2022 | | |
| Attorney Dkt #: | 1248/363B |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/30/2024
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Application #:
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17861011
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Filing Dt:
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07/08/2022
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Publication #:
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Pub Dt:
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10/27/2022
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Title:
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METHOD FOR FORMING CHIP PACKAGE WITH SECOND OPENING SURROUNDING FIRST OPENING HAVING CONDUCTIVE STRUCTURE THEREIN
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Assignee
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| 9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
| JHONGLI DIST. |
| TAOYUAN CITY, TAIWAN 32062 |
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Correspondence name and address
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WEN LIU
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350 S. FIGUEROA STREET, SUITE 975
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LOS ANGELES, CA 90071
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05/23/2024 04:25 AM
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