Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 052027/0090 | |
| Pages: | 3 |
| | Recorded: | 03/05/2020 | | |
| Attorney Dkt #: | 21XD-264571-US2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/09/2021
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Application #:
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16721549
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Filing Dt:
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12/19/2019
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Publication #:
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Pub Dt:
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04/23/2020
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Title:
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SEMICONDUCTOR DEVICE ASSEMBLY HAVING A THERMAL INTERFACE BOND BETWEEN A SEMICONDUCTOR DIE AND A PASSIVE HEAT EXCHANGER
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Assignee
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| 111 BUSINESS PARK DRIVE |
| UTICA, NEW YORK 13502 |
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Correspondence name and address
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SHEPPARD, MULLIN, RICHTER & HAMPTON LLP
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650 TOWN CENTER DRIVE, 4TH FLOOR
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COSTA MESA, CA 92626
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05/29/2024 04:11 AM
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