Patent Assignment Details
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| Reel/Frame: | 013057/0093 | |
| Pages: | 3 |
| | Recorded: | 07/03/2002 | | |
| Conveyance: | CERTIFICATE OF AMENDMENT |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/15/2002
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Application #:
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09740125
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Filing Dt:
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12/19/2000
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Publication #:
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Pub Dt:
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06/20/2002
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Title:
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SYSTEM AND METHOD FOR IMPROVED THROUGHPUT OF SEMICONDUCTOR WAFER PROCESSING
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Assignee
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| 6000 TECHNOLOGY BLVD. |
| SANDSTRON, VIRGINIA 23150 |
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Correspondence name and address
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SIEMENS CORPORTION
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ELSA KELLER
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186 WOOD AVENUE SOUTH
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INTELLECTUAL PROPERTY DEPARTMENT
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ISELIN, NJ 08830
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