Patent Assignment Details
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Reel/Frame: | 022138/0094 | |
| Pages: | 3 |
| | Recorded: | 01/20/2009 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/20/2007
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Application #:
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10806037
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Filing Dt:
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03/22/2004
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Publication #:
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Pub Dt:
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03/08/2007
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Title:
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THREE-DIMENSIONAL IMAGING PROCESSING MODULE INCORPORATING STACKED LAYERS CONTAINING MICROELECTRONIC CIRCUITS
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Assignee
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3001 REDHILL AVE., BUILDING 4, SUITE 108 |
COSTA MESA, CALIFORNIA USA 92626 |
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Correspondence name and address
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W. ERIC BOYD
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IRVINE SENSORS CORP.
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3001 REDHILL AVE.
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BUILDING 4, SUITE 108
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COSTA MESA, CA 92626
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