Patent Assignment Details
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Reel/Frame: | 010987/0096 | |
| Pages: | 2 |
| | Recorded: | 07/31/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/14/2003
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Application #:
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09629068
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Filing Dt:
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07/29/2000
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT-DISSIPATION STIFFENER AND METHOD OF FABRICATING THE SAME
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Assignee
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NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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DIKE, BRONSTEIN, ROBERTS CUSHMAN1
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EDWARDS & ANGELL, LLP
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PETER F. CORLESS
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130 WATER STREET
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BOSTON, MA 02109
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