Patent Assignment Details
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Reel/Frame: | 018498/0102 | |
| Pages: | 2 |
| | Recorded: | 11/08/2006 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/17/2006
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Application #:
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10995492
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Filing Dt:
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11/24/2004
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Publication #:
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Pub Dt:
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03/16/2006
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Title:
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METHOD FOR PACKAGING CHIP AND PACKAGE ASSEMBLY PRODUCED THEREBY
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Assignee
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1F., NO. 15, INDUSTRY E. ROAD IV, |
HSINCHU SCIENCE PARK |
HSIN-CHU 300, TAIWAN R.O.C. |
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Correspondence name and address
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MORTON J. ROSENBERG
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ROSENBERG, KLEIN & LEE
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3458 ELLICOTT CENTER DRIVE, SUITE 101
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ELLICOTT CITY, MARYLAND 21043
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