Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 012495/0105 | |
| Pages: | 4 |
| | Recorded: | 01/16/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
11
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Patent #:
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Issue Dt:
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03/07/2000
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Application #:
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09130360
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Filing Dt:
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08/06/1998
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Title:
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METHOD OF FORMING THERMAL CONDUCTIVE STRUCTURE ON PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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03/13/2001
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Application #:
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09138799
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Filing Dt:
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08/24/1998
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Title:
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PRINTED CIRCUIT BOARD WITH THERMAL CONDUCTIVE STRUCTURE
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Patent #:
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Issue Dt:
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07/24/2001
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Application #:
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09246220
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Filing Dt:
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02/08/1999
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Title:
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METHOD FOR MANUFACTURING A PLUG
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Patent #:
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Issue Dt:
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09/12/2000
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Application #:
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09246773
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Filing Dt:
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02/08/1999
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Title:
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THE METHOD OF MANUFACTURING A PLUG
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Patent #:
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Issue Dt:
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12/04/2001
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Application #:
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09250630
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Filing Dt:
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02/16/1999
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Title:
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APPARATUS FOR PACKAGING SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING THE SAME
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Patent #:
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Issue Dt:
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01/16/2001
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Application #:
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09267885
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Filing Dt:
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03/11/1999
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Title:
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THERMAL VIAS-PROVIDED CAVITY-DOWN IC PACKAGE STRUCTURE
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Patent #:
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Issue Dt:
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08/07/2001
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Application #:
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09395785
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Filing Dt:
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09/14/1999
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Title:
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ETCHING DEVICE
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Patent #:
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Issue Dt:
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06/04/2002
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Application #:
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09621166
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Filing Dt:
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07/21/2000
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Title:
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APPARATUS FOR MANUFACTURING PLUG AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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05/28/2002
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Application #:
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09871206
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Filing Dt:
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05/31/2001
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Title:
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METHOD OF FORMING MICRO-VIA
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09901500
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Filing Dt:
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07/03/2001
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Publication #:
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Pub Dt:
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01/09/2003
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Title:
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Method of laminating copper foil onto a printed circuit board
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Patent #:
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Issue Dt:
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06/15/2004
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Application #:
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09927723
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Filing Dt:
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08/10/2001
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Publication #:
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Pub Dt:
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02/13/2003
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Title:
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METHOD OF FABRICATING INTER-LAYER SOLID CONDUCTIVE RODS
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Assignee
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| KENG KOU VILLAGE, LU-CHU COUNTRY |
| NO. 66-6, HOU PI TSO, 9 LIN |
| TAOYUAN HSIEN, TAIWAN R.O.C |
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Correspondence name and address
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THOMAS, KAYDEN, HORSTEMEYER, ET AL.
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DANIEL R. MCCLURE
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100 GALLERIA PARKWAY
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SUITE 1500
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ATLANTA, GA 30339
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