Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 020008/0105 | |
| Pages: | 8 |
| | Recorded: | 10/24/2007 | | |
Attorney Dkt #: | 108298908US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2011
|
Application #:
|
11923290
|
Filing Dt:
|
10/24/2007
|
Publication #:
|
|
Pub Dt:
|
02/19/2009
| | | | |
Title:
|
MICROELECTRONIC DIE PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAME-BASED INTERPOSER FOR STACKED DIE PACKAGES, AND ASSOCIATED SYSTEMS AND METHODS
|
|
Assignee
|
|
|
8000 SOUTH FEDERAL WAY, P.O. BOX 6 |
BOISE, IDAHO 83716-9632 |
|
Correspondence name and address
|
|
PERKINS COIE LLP
|
|
P.O. BOX 1247
|
|
PAUL T. PARKER
|
|
SEATTLE, WA 98111-1247
|
Search Results as of:
05/29/2024 11:23 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|