Patent Assignment Details
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| Reel/Frame: | 014104/0111 | |
| Pages: | 3 |
| | Recorded: | 05/15/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/07/2004
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Application #:
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10438968
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Filing Dt:
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05/15/2003
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Title:
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SEMICONDUCTOR DIE PACKAGE WITH INCREASED THERMAL CONDUCTION
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Assignee
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| 20 SYLVAN RD. |
| WOBURN, MASSACHUSETTS 01801 |
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Correspondence name and address
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FARJAMI & FARJAMI LLP
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MOCHAEL FARJAMI, ESQ.
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16148 SAND CANYON
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IRVINE, CA 92618
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