Patent Assignment Details
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| Reel/Frame: | 017819/0111 | |
| Pages: | 2 |
| | Recorded: | 06/19/2006 | | |
| Attorney Dkt #: | 2846-0385PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/01/2008
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Application #:
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11385882
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Filing Dt:
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03/22/2006
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Publication #:
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Pub Dt:
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09/27/2007
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Title:
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METHOD FOR WAFER LEVEL PACKAGE OF SENSOR CHIP
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Assignee
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| NO. 1, SEC. 4, ROOSEVELT RD., DA-AN DISTRICT |
| TAIPEI CITY, TAIWAN R.O.C. 106 |
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Correspondence name and address
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JOE MCKINNEY MUNCY
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD, SUITE 100 EAST
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P.O. BOX EAST
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FALLS CHURCH, VA 22040-0747
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