Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 044907/0116 | |
| Pages: | 14 |
| | Recorded: | 12/18/2017 | | |
| Attorney Dkt #: | UTACS2015SVE103 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE TO INCLUDE US PATENT NUMBER 7922877 IN THE COVER SHEET PREVIOUSLY RECORDED ON REEL 044403 FRAME 0596. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
3
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Patent #:
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Issue Dt:
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04/17/2007
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Application #:
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10893087
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Filing Dt:
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07/16/2004
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Title:
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PROCESS OF FABRICATING SEMICONDUCTOR PACKAGES USING LEADFRAMES ROUGHENED WITH CHEMICAL ETCHANT
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Patent #:
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Issue Dt:
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02/05/2008
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Application #:
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11292769
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Filing Dt:
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12/02/2005
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Publication #:
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Pub Dt:
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05/11/2006
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING LEADFRAME ROUGHENED WITH CHEMICAL ETCHANT TO PREVENT SEPARATION BETWEEN LEADFRAME AND MOLDING COMPOUND
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Patent #:
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Issue Dt:
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04/12/2011
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Application #:
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12639269
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Filing Dt:
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12/16/2009
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Publication #:
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Pub Dt:
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06/10/2010
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Title:
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METHOD AND APPARATUS FOR PLATING A SEMICONDUCTOR PACKAGE
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Assignee
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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Correspondence name and address
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HORIZON IP PTE. LTD.
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7500A BEACH ROAD, #04-306/308
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THE PLAZA
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SINGAPORE, 199591 SINGAPORE
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