Patent Assignment Details
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Reel/Frame: | 007144/0117 | |
| Pages: | 3 |
| | Recorded: | 09/01/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/12/1996
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Application #:
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08299520
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Filing Dt:
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09/01/1994
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Title:
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TAPE WITH SOLDER FORMS AND METHODS FOR TRANSFERRING SOLDER TO CHIP ASSEMBLIES
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Assignee
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2200 MISSION COLLEGE BLVD. SANTA CLARA, CA 95052 |
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Correspondence name and address
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BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN
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ERIC S. HYMAN
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12400 WILSHIRE BLVD., 7TH FL.
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LOS ANGELES, CA 90025
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