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Patent Assignment Details
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Reel/Frame:014734/0117   Pages: 3
Recorded: 11/20/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 10
1
Patent #:
Issue Dt:
11/16/1999
Application #:
08897968
Filing Dt:
07/21/1997
Title:
POLYMERIZABLE FLUXING AGENTS AND FLUXING ADHESIVE COMPOSITIONS THEREFROM
2
Patent #:
Issue Dt:
11/16/1999
Application #:
08926159
Filing Dt:
09/09/1997
Title:
CARBOXYL-CONTAINING POLYUNSATURATED FLUXING ADHESIVE FOR ATTACHING INTEGRATED CIRCUITS
3
Patent #:
Issue Dt:
01/25/2000
Application #:
09012382
Filing Dt:
01/23/1998
Title:
CARBOXYL-CONTAINING POLYUNSATURATED FLUXING AGENT AND CARBOXYL-REACTIVE NEUTRALIZING AGENT AS ADHESIVE
4
Patent #:
Issue Dt:
09/19/2000
Application #:
09120172
Filing Dt:
07/21/1998
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
5
Patent #:
Issue Dt:
10/02/2001
Application #:
09137971
Filing Dt:
08/21/1998
Title:
SEMICONDUCTOR FLIP-CHIP ASSEMBLY WITH PRE-APPLIED ENCAPSULATING LAYERS
6
Patent #:
Issue Dt:
10/17/2000
Application #:
09372709
Filing Dt:
08/11/1999
Title:
POLMERIZABLE FLUXING AGENTS AND FLUXING ADHESIVE COMPOSITIONS THEREFROM
7
Patent #:
Issue Dt:
01/01/2002
Application #:
09517839
Filing Dt:
03/02/2000
Title:
Semiconductor flip-chip package and method for the fabrication thereof
8
Patent #:
Issue Dt:
02/11/2003
Application #:
09662641
Filing Dt:
09/15/2000
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
9
Patent #:
Issue Dt:
05/20/2003
Application #:
09662642
Filing Dt:
09/15/2000
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
10
Patent #:
Issue Dt:
06/04/2002
Application #:
09948921
Filing Dt:
09/07/2001
Publication #:
Pub Dt:
03/14/2002
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
Assignor
1
Exec Dt:
11/13/2003
Assignee
1
310 VIA VERA CRUZ, SUITE 107
SAN MARCOS, CALIFORNIA 92069
Correspondence name and address
NATH & ASSOCIATES
GARY M. NATH
1030 15TH STREET, N.W.
WASHINGTON, D.C. 20005

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