Patent Assignment Details
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| Reel/Frame: | 036800/0118 | |
| Pages: | 4 |
| | Recorded: | 10/15/2015 | | |
| Attorney Dkt #: | 5900/0378PUS2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/11/2017
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Application #:
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14883135
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Filing Dt:
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10/14/2015
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Publication #:
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Pub Dt:
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02/04/2016
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Title:
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STACKED STRUCTURE OF SEMICONDUCTOR CHIPS HAVING VIA HOLES AND METAL BUMPS
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Assignee
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| NO. 69, TECHNOLOGY 7TH RD., HWAYA TECHNOLOGY PARK, |
| GUISHAN DISTRICT, TAOYUAN CITY,, TAIWAN |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, P.C.
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4000 LEGATO ROAD, SUITE 310
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FAIRFAX, VA 22033
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