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Patent Assignment Details
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Reel/Frame:032641/0121   Pages: 38
Recorded: 04/09/2014
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 8
1
Patent #:
Issue Dt:
04/13/2004
Application #:
10145013
Filing Dt:
05/13/2002
Publication #:
Pub Dt:
11/21/2002
Title:
METHOD FOR MANUFACTURING BURIED AREAS
2
Patent #:
Issue Dt:
04/06/2004
Application #:
10145169
Filing Dt:
05/13/2002
Publication #:
Pub Dt:
11/21/2002
Title:
METHOD FOR MANUFACTURING A SILICON WAFER
3
Patent #:
Issue Dt:
07/20/2004
Application #:
10145172
Filing Dt:
05/13/2002
Publication #:
Pub Dt:
11/21/2002
Title:
METHOD FOR MANUFACTURING COMPONENTS ON AN SOI WAFER
4
Patent #:
Issue Dt:
10/19/2004
Application #:
10167960
Filing Dt:
06/11/2002
Publication #:
Pub Dt:
01/02/2003
Title:
PROCESS FOR MANUFACTURING A DMOS TRANSISTOR
5
Patent #:
Issue Dt:
04/12/2011
Application #:
11447094
Filing Dt:
06/06/2006
Publication #:
Pub Dt:
12/14/2006
Title:
METHOD FOR MANUFACTURING A METAL-SEMICONDUCTOR CONTACT IN SEMICONDUCTOR COMPONENTS
6
Patent #:
Issue Dt:
07/05/2011
Application #:
11730514
Filing Dt:
04/02/2007
Publication #:
Pub Dt:
10/11/2007
Title:
LATERAL DMOS TRANSISTOR AND METHOD FOR THE PRODUCTION THEREOF
7
Patent #:
Issue Dt:
12/14/2010
Application #:
11812386
Filing Dt:
06/18/2007
Publication #:
Pub Dt:
11/15/2007
Title:
METHOD FOR PRODUCING DEEP TRENCH STRUCTURES
8
Patent #:
Issue Dt:
12/16/2008
Application #:
11819134
Filing Dt:
06/25/2007
Publication #:
Pub Dt:
05/29/2008
Title:
AMPLIFIER CIRCUIT
Assignor
1
Exec Dt:
11/25/2013
Assignee
1
THERESIENSTRASSE 2
ANNETTE NICKERSON
HEILBRONN, GERMANY 74072
Correspondence name and address
TELEFUNKEN SEMICONDUCTORS GMBH & CO. KG
THERESIENSTRASSE 2
DR. PLATHNER / INSOLVENCY ADMINISTRATOR
HEILBRONN, 74072 GERMANY

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