Patent Assignment Details
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Reel/Frame: | 057047/0121 | |
| Pages: | 5 |
| | Recorded: | 07/30/2021 | | |
Attorney Dkt #: | OPI21300584US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17427613
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Filing Dt:
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07/30/2021
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Publication #:
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Pub Dt:
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08/11/2022
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Title:
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Balun Circuit Structure and Balun Device
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Assignee
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2800 CHUANGXIN AVE, RM 602, FLOOR 6, BLOCK C, BLDG J1, HEFEI INNOVATION INDUSTRIAL PARK PHASE II, HIGH-TECH INDUSTRIAL DEVELOPMENT ZONE, HEFEI |
ANHUI, CHINA 230088 |
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Correspondence name and address
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IP & T GROUP LLP
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102 MAPLE AVE E.
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VIENNA, VA 22180
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05/25/2024 10:39 PM
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