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Reel/Frame:032659/0123   Pages: 5
Recorded: 04/11/2014
Attorney Dkt #:090104-0852
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/12/2016
Application #:
14251170
Filing Dt:
04/11/2014
Publication #:
Pub Dt:
10/16/2014
Title:
ELECTRONIC DEVICE PACKAGE AND PACKAGE SUBSTRATE FOR THE SAME
Assignors
1
Exec Dt:
11/08/2013
2
Exec Dt:
11/08/2013
3
Exec Dt:
11/08/2013
Assignee
1
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742
Correspondence name and address
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001

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