Patent Assignment Details
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Reel/Frame: | 032659/0123 | |
| Pages: | 5 |
| | Recorded: | 04/11/2014 | | |
Attorney Dkt #: | 090104-0852 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/12/2016
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Application #:
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14251170
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Filing Dt:
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04/11/2014
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Publication #:
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Pub Dt:
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10/16/2014
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Title:
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ELECTRONIC DEVICE PACKAGE AND PACKAGE SUBSTRATE FOR THE SAME
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Assignee
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129, SAMSUNG-RO, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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