Patent Assignment Details
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| Reel/Frame: | 061305/0123 | |
| Pages: | 4 |
| | Recorded: | 10/04/2022 | | |
| Attorney Dkt #: | LIM.101 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/23/2024
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Application #:
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17935410
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Filing Dt:
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09/26/2022
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Publication #:
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Pub Dt:
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05/18/2023
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Title:
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ELECTROPLATING SOLUTION OF TIN OR TIN ALLOY WITH IMPROVED THICKNESS VARIATION OF WAFER BUMPS
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Assignee
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| 15 BLOCK 1 LOT, BANWOL INDUSTRIAL COMPLEX, 91 MOKNAE-RO 119BEON-GIL, DANWON-GU |
| ANSAN-SI GYEONGGI-DO, KOREA, REPUBLIC OF 15602 |
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Correspondence name and address
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JEFF LLOYD
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P.O. BOX 142950
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GAINESVILLE, FL 32614-2950
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