Patent Assignment Details
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| Reel/Frame: | 037415/0124 | |
| Pages: | 3 |
| | Recorded: | 01/06/2016 | | |
| Attorney Dkt #: | OP-104000804 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/10/2019
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Application #:
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14988753
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Filing Dt:
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01/06/2016
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Publication #:
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Pub Dt:
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07/28/2016
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Title:
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LIQUID COOLING HEAT SINK STRUCTURE AND COOLING CIRCULATION SYSTEM THEREOF
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Assignee
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| 9F., NO. 778-1, CHUNG-CHENG RD., ZHONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN 235 |
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Correspondence name and address
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HDLS IPR SERVICES
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P.O. BOX 230970
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CENTREVILLE, VA 20120
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06/15/2024 11:47 AM
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