Patent Assignment Details
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Reel/Frame: | 058259/0124 | |
| Pages: | 7 |
| | Recorded: | 12/01/2021 | | |
Attorney Dkt #: | 2515.0558 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/19/2024
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Application #:
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17457155
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Filing Dt:
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12/01/2021
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Publication #:
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Pub Dt:
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06/01/2023
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Title:
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Semiconductor Manufacturing Equipment and Method of Providing Support Base with Filling Material Disposed into Openings in Semiconductor Wafer for Support
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Assignee
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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PATENT LAW GROUP: ATKINS AND ASSOCIATES, P.C.
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123 W. CHANDLER HEIGHTS ROAD, #12535
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CHANDLER, AZ 85248
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05/30/2024 04:01 AM
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