Patent Assignment Details
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| Reel/Frame: | 056586/0125 | |
| Pages: | 8 |
| | Recorded: | 06/18/2021 | | |
| Attorney Dkt #: | 105358P010 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/18/2023
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Application #:
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17351664
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Filing Dt:
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06/18/2021
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Publication #:
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Pub Dt:
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07/07/2022
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Title:
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Multilayer Circuit Board
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Assignee
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| 2 FLOOR, #1, LANE 500, SHENGXIA ROAD, PUDONG |
| SHANGHAI, CHINA 201210 |
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Correspondence name and address
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WOMBLE BOND DICKINSON(US) LLP/KGS ATTN:
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P.O. BOX 7037
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ATLANTA, GA 30357-0037
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