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Reel/Frame:038003/0126   Pages: 5
Recorded: 03/16/2016
Attorney Dkt #:1012-1293 / 2014P52101 US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/31/2018
Application #:
15016039
Filing Dt:
02/04/2016
Publication #:
Pub Dt:
08/11/2016
Title:
Semiconductor Chip Package Having Contact Pins at Short Side Edges
Assignors
1
Exec Dt:
02/05/2016
2
Exec Dt:
02/05/2016
3
Exec Dt:
02/05/2016
4
Exec Dt:
02/05/2016
5
Exec Dt:
02/05/2016
6
Exec Dt:
02/05/2016
7
Exec Dt:
02/05/2016
8
Exec Dt:
02/05/2016
Assignee
1
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondence name and address
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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