Patent Assignment Details
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Reel/Frame: | 050255/0127 | |
| Pages: | 6 |
| | Recorded: | 09/03/2019 | | |
Attorney Dkt #: | 123193-7926 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE OMISSION OF THE FIFTH AND SIXTH INVENTOR'S DATA PREVIOUSLY RECORDED ON REEL 050208 FRAME 0098. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/04/2022
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Application #:
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16554278
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Filing Dt:
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08/28/2019
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Publication #:
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Pub Dt:
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12/31/2020
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING FRAME IN WHICH SEMICONDUCTOR CHIP IS EMBEDDED
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Assignee
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MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MORGAN, LEWIS & BOCKIUS LLP
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1111 PENNSYLVANIA AVENUE, NW
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WASHINGTON, DC 20004
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