Patent Assignment Details
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| Reel/Frame: | 061389/0127 | |
| Pages: | 4 |
| | Recorded: | 10/12/2022 | | |
| Attorney Dkt #: | 2018P18835US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18045854
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Filing Dt:
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10/12/2022
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Publication #:
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Pub Dt:
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03/02/2023
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Title:
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CHIP-ON-ARRAY WITH INTERPOSER FOR A MULTIDIMENSIONAL TRANSDUCER ARRAY
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Assignee
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| 40 LIBERTY BLVD |
| MALVERN, PENNSYLVANIA 19355 |
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Correspondence name and address
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SARA HUARD
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3850 QUADRANGLE BLVD
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SIEMENS CORPORATION, IP DEPARTMENT
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ORLANDO, FL 32817
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06/03/2024 03:06 PM
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