Patent Assignment Details
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| Reel/Frame: | 005910/0128 | |
| Pages: | 4 |
| | Recorded: | 11/04/1991 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/08/1992
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Application #:
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07787843
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Filing Dt:
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11/04/1991
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Title:
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METHOD FOR COMBINING DIE ATTACH AND LEAD BOND IN THE ASSEMBLY OF A SEMICONDUCTOR PACKAGE
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Assignee
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| 2805 E. COLUMBIA ROAD, BOISE, ID 83706 |
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Correspondence name and address
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WAYNE E. DUFFY
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PATENT LEGAL DEPT.
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MICRON TECH., INC.
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2805 EAST COLUMBIA RD.
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BOISE, ID 83706
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