Patent Assignment Details
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| Reel/Frame: | 005973/0131 | |
| Pages: | 2 |
| | Recorded: | 12/31/1991 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/29/1994
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Application #:
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07815401
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Filing Dt:
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12/31/1991
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Title:
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METHOD OF MAKING A MULTI-LAYER CIRCUIT ASSEMBLY
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Assignee
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| A CORP. OF DE. |
| 103 FAIRVIEW PARK DR. |
| ELMSFORD, NEW YORK 10523 |
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Correspondence name and address
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LERNER, DAVID, LITTENBERG,
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KRUMHOLZ AND MENTLIK
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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