Patent Assignment Details
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| Reel/Frame: | 057010/0131 | |
| Pages: | 5 |
| | Recorded: | 07/28/2021 | | |
| Attorney Dkt #: | KOR-716D1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17387800
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Filing Dt:
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07/28/2021
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Publication #:
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Pub Dt:
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11/18/2021
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Title:
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LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDING PART AND A BONDING TARGET
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Assignee
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| 218, GAJEONG-RO, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 34129 |
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Correspondence name and address
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RABIN & BERDO, P.C.
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2650 PARK TOWER DRIVE, SUITE 800
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VIENNA, VA 22180
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