Patent Assignment Details
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| Reel/Frame: | 021683/0133 | |
| Pages: | 2 |
| | Recorded: | 10/15/2008 | | |
| Attorney Dkt #: | 201-1078 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/27/2011
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Application #:
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12251534
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Filing Dt:
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10/15/2008
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Publication #:
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Pub Dt:
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04/23/2009
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Title:
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SEMICONDUCTOR PACKAGE, MODULE, SYSTEM HAVING SOLDER BALL COUPLED TO CHIP PAD AND MANUFACTURING METHOD THEREOF
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Assignee
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| 416 MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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STANZIONE & KIM, LLP
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919 18TH STREET, N.W.
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SUITE 440
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WASHINGTON, DC 20006
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