Patent Assignment Details
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Reel/Frame: | 018822/0134 | |
| Pages: | 2 |
| | Recorded: | 01/26/2007 | | |
Attorney Dkt #: | IR-2877(2-5722) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/25/2017
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Application #:
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11595206
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Filing Dt:
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11/10/2006
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Publication #:
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Pub Dt:
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05/17/2007
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS
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Assignee
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233 KANSAS STREET |
EL SEGUNDO, CALIFORNIA 90245 |
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Correspondence name and address
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OSTROLENK, FABER, GERB & SOFFEN, LLP
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1180 AVENUE OF THE AMERICAS
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NEW YORK, NEW YORK 10036-8403
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