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Reel/Frame:	054067/0135			Pages:	57
		Recorded:	10/09/2020
Attorney Dkt #:	76809US01
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 541
Page 1 of 6
Pages: 1 2 3 4 5 6

Patent #:	6589801	Issue Dt:	07/08/2003	Application #:	09385694	Filing Dt:	08/30/1999
Title:	WAFER-SCALE PRODUCTION OF CHIP-SCALE SEMICONDUCTOR PACKAGES USING WAFER MAPPING TECHNIQUES

Patent #:	6517656	Issue Dt:	02/11/2003	Application #:	09412889	Filing Dt:	10/05/1999
Title:	METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE USING A BATCH STEP FOR CURING A DIE ATTACHMENT FILM AND A TOOL SYSTEM FOR PERFORMING THE METHOD

Patent #:	6580159	Issue Dt:	06/17/2003	Application #:	09434589	Filing Dt:	11/05/1999
Title:	INTEGRATED CIRCUIT DEVICE PACKAGES AND SUBSTRATES FOR MAKING THE PACKAGES

Patent #:	6847103	Issue Dt:	01/25/2005	Application #:	09436158	Filing Dt:	11/09/1999
Title:	SEMICONDUCTOR PACKAGE WITH EXPOSED DIE PAD AND BODY-LOCKING LEADFRAME

Patent #:	6627864	Issue Dt:	09/30/2003	Application #:	09447202	Filing Dt:	11/22/1999
Title:	THIN IMAGE SENSOR PACKAGE HAVING TRANSPARENT SUBSTRATE

Patent #:	6526653	Issue Dt:	03/04/2003	Application #:	09457515	Filing Dt:	12/08/1999
Title:	METHOD OF ASSEMBLING A SNAP LID IMAGE SENSOR PACKAGE

Patent #:	6515269	Issue Dt:	02/04/2003	Application #:	09490717	Filing Dt:	01/25/2000
Title:	PROTECTED IMAGE SENSOR PACKAGE

Patent #:	6512219	Issue Dt:	01/28/2003	Application #:	09491112	Filing Dt:	01/25/2000
Title:	PROTECTED IMAGE SENSOR PACKAGE FABRICATION METHOD

Patent #:	6656765	Issue Dt:	12/02/2003	Application #:	09496991	Filing Dt:	02/02/2000
Title:	FABRICATING VERY THIN CHIP SIZE SEMICONDUCTOR PACKAGES

Patent #:	7009283	Issue Dt:	03/07/2006	Application #:	09513067	Filing Dt:	02/24/2000
Title:	NONEXPOSED HEAT SINK FOR SEMICONDUCTOR PACKAGE

Patent #:	6596212	Issue Dt:	07/22/2003	Application #:	09528884	Filing Dt:	03/20/2000
Title:	METHOD AND APPARATUS FOR INCREASING THICKNESS OF MOLDED BODY SEMICONDUCTOR PACKAGE

Patent #:	6571466	Issue Dt:	06/03/2003	Application #:	09536830	Filing Dt:	03/27/2000
Title:	FLIP CHIP IMAGE SENSOR PACKAGE FABRICATION METHPD

Patent #:	6580620	Issue Dt:	06/17/2003	Application #:	09548705	Filing Dt:	04/13/2000
Title:	MATRIX TYPE PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGES

Patent #:	6601293	Issue Dt:	08/05/2003	Application #:	09551416	Filing Dt:	04/18/2000
Title:	METHOD OF MAKING AN ELECTROMAGNETIC INTERFERENCE SHIELD DEVICE

Patent #:	6515356	Issue Dt:	02/04/2003	Application #:	09566069	Filing Dt:	05/05/2000
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Patent #:	6518659	Issue Dt:	02/11/2003	Application #:	09566658	Filing Dt:	05/08/2000
Title:	STACKABLE PACKAGE HAVING A CAVITY AND A LID FOR AN ELECTRONIC DEVICE

Patent #:	6683377	Issue Dt:	01/27/2004	Application #:	09583183	Filing Dt:	05/30/2000
Title:	MULTI-STACKED MEMORY PACKAGE

Patent #:	6531784	Issue Dt:	03/11/2003	Application #:	09585915	Filing Dt:	06/02/2000
Title:	SEMICONDUCTOR PACKAGE WITH SPACER STRIPS

Patent #:	6521982	Issue Dt:	02/18/2003	Application #:	09587136	Filing Dt:	06/02/2000
Title:	PACKAGING HIGH POWER INTEGRATED CIRCUIT DEVICES

Patent #:	6512288	Issue Dt:	01/28/2003	Application #:	09589713	Filing Dt:	06/07/2000
Title:	CIRCUIT BOARD SEMICONDUCTOR PACKAGE

Patent #:	6889813	Issue Dt:	05/10/2005	Application #:	09602162	Filing Dt:	06/22/2000
Title:	MATERIAL TRANSPORT METHOD

Patent #:	6695120	Issue Dt:	02/24/2004	Application #:	09602195	Filing Dt:	06/22/2000
Title:	ASSEMBLY FOR TRANSPORTING MATERIAL

Patent #:	6530735	Issue Dt:	03/11/2003	Application #:	09602196	Filing Dt:	06/22/2000
Title:	GRIPPER ASSEMBLY

Patent #:	6534876	Issue Dt:	03/18/2003	Application #:	09608298	Filing Dt:	06/30/2000
Title:	FLIP-CHIP MICROMACHINE PACKAGE

Patent #:	6546620	Issue Dt:	04/15/2003	Application #:	09608357	Filing Dt:	06/29/2000
Title:	FLIP CHIP INTEGRATED CIRCUIT AND PASSIVE CHIP COMPONENT PACKAGE FABRICATION METHOD

Patent #:	6667544	Issue Dt:	12/23/2003	Application #:	09608419	Filing Dt:	06/30/2000
Title:	STACKABLE PACKAGE HAVING CLIPS FOR FASTENING PACKAGE AND TOOL FOR OPENING CLIPS

Patent #:	6503780	Issue Dt:	01/07/2003	Application #:	09610309	Filing Dt:	07/05/2000
Title:	WAFER SCALE IMAGE SENSOR PACKAGE FABRICATION METHOD

Patent #:	6563204	Issue Dt:	05/13/2003	Application #:	09615670	Filing Dt:	07/14/2000
Title:	MICROCIRCUIT DIE-SAWING PROTECTOR

Patent #:	6798049	Issue Dt:	09/28/2004	Application #:	09648284	Filing Dt:	08/24/2000
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Patent #:	6577013	Issue Dt:	06/10/2003	Application #:	09655439	Filing Dt:	09/05/2000
Title:	CHIP SIZE SEMICONDUCTOR PACKAGES WITH STACKED DIES

Patent #:	6624005	Issue Dt:	09/23/2003	Application #:	09656253	Filing Dt:	09/06/2000
Title:	SEMICONDUCTOR MEMORY CARDS AND METHOD OF MAKING SAME

Patent #:	6552416	Issue Dt:	04/22/2003	Application #:	09659017	Filing Dt:	09/08/2000
Title:	MULTIPLE DIE LEAD FRAME PACKAGE WITH ENHANCED DIE-TO DIE INTERCONNECT ROUTING USING INTERNAL LEAD TRACE WIRING

Patent #:	6522015	Issue Dt:	02/18/2003	Application #:	09670499	Filing Dt:	09/26/2000
Title:	MICROMACHINE STACKED WIREBONDED PACKAGE

Patent #:	6638789	Issue Dt:	10/28/2003	Application #:	09670500	Filing Dt:	09/26/2000
Title:	MICROMACHINE STACKED WIREBONDED PACKAGE FABRICATION METHOD

Patent #:	6530515	Issue Dt:	03/11/2003	Application #:	09670501	Filing Dt:	09/26/2000
Title:	MICROMACHINE STACKED FLIP CHIP PACKAGE FABRICATION METHOD

Patent #:	7102208	Issue Dt:	09/05/2006	Application #:	09687048	Filing Dt:	10/13/2000
Title:	LEADFRAME AND SEMICONDUCTOR PACKAGE WITH IMPROVED SOLDER JOINT STRENGTH

Patent #:	6525406	Issue Dt:	02/25/2003	Application #:	09687049	Filing Dt:	10/13/2000
Title:	SEMICONDUCTOR DEVICE HAVING INCREASED MOISTURE PATH AND INCREASED SOLDER JOINT STRENGTH

Patent #:	6616436	Issue Dt:	09/09/2003	Application #:	09687126	Filing Dt:	10/13/2000
Title:	APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGES

Patent #:	6627976	Issue Dt:	09/30/2003	Application #:	09687331	Filing Dt:	10/13/2000
Title:	LEADFRAME FOR SEMICONDUCTOR PACKAGE AND MOLD FOR MOLDING THE SAME

Patent #:	6677662	Issue Dt:	01/13/2004	Application #:	09687487	Filing Dt:	10/13/2000
Title:	CLAMP AND HEAT BLOCK ASSEMBLY FOR WIRE BONDING A SEMICONDUCTOR PACKAGE ASSEMBLY

Patent #:	6853059	Issue Dt:	02/08/2005	Application #:	09687493	Filing Dt:	10/13/2000
Title:	SEMICONDUCTOR PACKAGE HAVING IMPROVED ADHESIVENESS AND GROUND BONDING

Patent #:	6753597	Issue Dt:	06/22/2004	Application #:	09687495	Filing Dt:	10/13/2000
Title:	ENCAPSULATED SEMICONDUCTOR PACKAGE INCLUDING CHIP PADDLE AND LEADS

Patent #:	6730544	Issue Dt:	05/04/2004	Application #:	09687530	Filing Dt:	10/13/2000
Title:	STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

Patent #:	6605866	Issue Dt:	08/12/2003	Application #:	09687531	Filing Dt:	10/13/2000
Title:	STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

Patent #:	6677663	Issue Dt:	01/13/2004	Application #:	09687536	Filing Dt:	10/13/2000
Title:	END GRID ARRAY SEMICONDUCTOR PACKAGE

Patent #:	6555899	Issue Dt:	04/29/2003	Application #:	09687541	Filing Dt:	10/13/2000
Title:	SEMICONDUCTOR PACKAGE LEADFRAME ASSEMBLY AND METHOD OF MANUFACTURE

Patent #:	6696747	Issue Dt:	02/24/2004	Application #:	09687585	Filing Dt:	10/13/2000
Title:	SEMICONDUCTOR PACKAGE HAVING REDUCED THICKNESS

Patent #:	6646339	Issue Dt:	11/11/2003	Application #:	09687787	Filing Dt:	10/13/2000
Title:	THIN AND HEAT RADIANT SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING

Patent #:	6639308	Issue Dt:	10/28/2003	Application #:	09687876	Filing Dt:	10/13/2000
Title:	NEAR CHIP SIZE SEMICONDUCTOR PACKAGE

Patent #:	6521987	Issue Dt:	02/18/2003	Application #:	09703195	Filing Dt:	10/31/2000
Title:	PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE AND METHOD FOR MAKING THE PACKAGE

Patent #:	6509560	Issue Dt:	01/21/2003	Application #:	09711993	Filing Dt:	11/13/2000
Title:	CHIP SIZE IMAGE SENSOR IN WIREBOND PACKAGE WITH STEP-UP RING FOR ELECTRICAL CONTACT

Patent #:	6629633	Issue Dt:	10/07/2003	Application #:	09711994	Filing Dt:	11/13/2000
Title:	CHIP SIZE IMAGE SENSOR BUMPER PACKAGE FABRICATION METHOD

Patent #:	6528857	Issue Dt:	03/04/2003	Application #:	09712313	Filing Dt:	11/13/2000
Title:	CHIP SIZE IMAGE SENSOR BUMPED PACKAGE

Patent #:	6620646	Issue Dt:	09/16/2003	Application #:	09712314	Filing Dt:	11/13/2000
Title:	CHIP SIZE IMAGE SENSOR WIREBOND PACKAGE FABRICATION METHOD

Patent #:	6849916	Issue Dt:	02/01/2005	Application #:	09713848	Filing Dt:	11/15/2000
Title:	FLIP CHIP ON GLASS IMAGE SENSOR PACKAGE

Patent #:	6532157	Issue Dt:	03/11/2003	Application #:	09714622	Filing Dt:	11/16/2000
Title:	ANGULATED SEMICONDUCTOR PACKAGES

Patent #:	6566164	Issue Dt:	05/20/2003	Application #:	09733148	Filing Dt:	12/07/2000
Title:	EXPOSED COPPER STRAP IN A SEMICONDUCTOR PACKAGE

Patent #:	6642610	Issue Dt:	11/04/2003	Application #:	09745265	Filing Dt:	12/20/2000
Publication #:	US20020064905	Pub Dt:	05/30/2002
Title:	WIRE BONDING METHOD AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME

Patent #:	6963141	Issue Dt:	11/08/2005	Application #:	09746018	Filing Dt:	12/26/2000
Publication #:	US20010019181	Pub Dt:	09/06/2001
Title:	STRUCTURE OF HEAT SLUG-EQUIPPED PACKAGES AND THE PACKAGING METHOD OF THE SAME

Patent #:	6672773	Issue Dt:	01/06/2004	Application #:	09751536	Filing Dt:	12/29/2000
Title:	OPTICAL FIBER HAVING TAPERED END AND OPTICAL CONNECTOR WITH RECIPROCAL OPENING

Patent #:	6875379	Issue Dt:	04/05/2005	Application #:	09751537	Filing Dt:	12/29/2000
Publication #:	US20040245659	Pub Dt:	12/09/2004
Title:	TOOL AND METHOD FOR FORMING AN INTEGRATED OPTICAL CIRCUIT

Patent #:	6564454	Issue Dt:	05/20/2003	Application #:	09752244	Filing Dt:	12/28/2000
Title:	METHOD OF MAKING AND STACKING A SEMICONDUCTOR PACKAGE

Patent #:	6990226	Issue Dt:	01/24/2006	Application #:	09758325	Filing Dt:	01/10/2001
Publication #:	US20010051000	Pub Dt:	12/13/2001
Title:	PATTERN RECOGNITION METHOD

Patent #:	6984879	Issue Dt:	01/10/2006	Application #:	09758332	Filing Dt:	01/10/2001
Publication #:	US20010053244	Pub Dt:	12/20/2001
Title:	CLAMP FOR PATTERN RECOGNITION

Patent #:	6686588	Issue Dt:	02/03/2004	Application #:	09764165	Filing Dt:	01/16/2001
Title:	OPTICAL MODULE WITH LENS INTEGRAL HOLDER

Patent #:	6610167	Issue Dt:	08/26/2003	Application #:	09764166	Filing Dt:	01/16/2001
Title:	METHOD FOR FABRICATING A SPECIAL-PURPOSE DIE USING A POLYMERIZABLE TAPE

Patent #:	6572944	Issue Dt:	06/03/2003	Application #:	09764190	Filing Dt:	01/16/2001
Title:	STRUCTURE FOR FABRICATING A SPECIAL-PURPOSE DIE USING A POLYMERIZABLE TAPE

Patent #:	7059040	Issue Dt:	06/13/2006	Application #:	09764196	Filing Dt:	01/16/2001
Title:	OPTICAL MODULE WITH LENS INTEGRAL HOLDER FABRICATION METHOD

Patent #:	6762078	Issue Dt:	07/13/2004	Application #:	09774952	Filing Dt:	01/30/2001
Publication #:	US20010005601	Pub Dt:	06/28/2001
Title:	SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP WITHIN CENTRAL APERTURE OF SUBSTRATE

Patent #:	6869861	Issue Dt:	03/22/2005	Application #:	09803083	Filing Dt:	03/08/2001
Title:	BACK-SIDE WAFER SINGULATION METHOD

Patent #:	6943429	Issue Dt:	09/13/2005	Application #:	09803084	Filing Dt:	03/08/2001
Title:	Wafer having alignment marks extending from a first to a second surface of the wafer

Patent #:	6624921	Issue Dt:	09/23/2003	Application #:	09804805	Filing Dt:	03/12/2001
Title:	MICROMIRROR DEVICE PACKAGE FABRICATION METHOD

Patent #:	6580153	Issue Dt:	06/17/2003	Application #:	09811183	Filing Dt:	03/14/2001
Title:	STRUCTURE FOR PROTECTING A MICROMACHINE WITH A CAVITY IN A UV TAPE

Patent #:	6545345	Issue Dt:	04/08/2003	Application #:	09813485	Filing Dt:	03/20/2001
Title:	MOUNTING FOR A PACKAGE CONTAINING A CHIP

Patent #:	6759737	Issue Dt:	07/06/2004	Application #:	09816599	Filing Dt:	03/23/2001
Publication #:	US20030001252	Pub Dt:	01/02/2003
Title:	SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS WITH ALIGNED INPUT/OUTPUT PADS

Patent #:	6858919	Issue Dt:	02/22/2005	Application #:	09816852	Filing Dt:	03/23/2001
Publication #:	US20020020907	Pub Dt:	02/21/2002
Title:	SEMICONDUCTOR PACKAGE

Patent #:	6597059	Issue Dt:	07/22/2003	Application #:	09825785	Filing Dt:	04/04/2001
Title:	THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE

Patent #:	6528869	Issue Dt:	03/04/2003	Application #:	09827619	Filing Dt:	04/06/2001
Title:	SEMICONDUCTOR PACKAGE WITH MOLDED SUBSTRATE AND RECESSED INPUT/OUTPUT TERMINALS

Patent #:	6756658	Issue Dt:	06/29/2004	Application #:	09827791	Filing Dt:	04/06/2001
Title:	MAKING TWO LEAD SURFACE MOUNTING HIGH POWER MICROLEADFRAME SEMICONDUCTOR PACKAGES

Patent #:	6603072	Issue Dt:	08/05/2003	Application #:	09828046	Filing Dt:	04/06/2001
Title:	MAKING LEADFRAME SEMICONDUCTOR PACKAGES WITH STACKED DIES AND INTERCONNECTING INTERPOSER

Patent #:	6791166	Issue Dt:	09/14/2004	Application #:	09829341	Filing Dt:	04/09/2001
Title:	STACKABLE LEAD FRAME PACKAGE USING EXPOSED INTERNAL LEAD TRACES

Patent #:	6580167	Issue Dt:	06/17/2003	Application #:	09839284	Filing Dt:	04/20/2001
Title:	HEAT SPREADER WITH SPRING IC PACKAGE

Patent #:	6562655	Issue Dt:	05/13/2003	Application #:	09839288	Filing Dt:	04/20/2001
Title:	HEAT SPREADER WITH SPRING IC PACKAGE FABRICATION METHOD

Patent #:	6528875	Issue Dt:	03/04/2003	Application #:	09839305	Filing Dt:	04/20/2001
Title:	VACUUM SEALED PACKAGE FOR SEMICONDUCTOR CHIP

Patent #:	7042068	Issue Dt:	05/09/2006	Application #:	09845601	Filing Dt:	04/27/2001
Publication #:	US20050029638	Pub Dt:	02/10/2005
Title:	LEADFRAME AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME

Patent #:	6614102	Issue Dt:	09/02/2003	Application #:	09848864	Filing Dt:	05/04/2001
Title:	SHIELDED SEMICONDUCTOR LEADFRAME PACKAGE

Patent #:	6707168	Issue Dt:	03/16/2004	Application #:	09848932	Filing Dt:	05/04/2001
Title:	SHIELDED SEMICONDUCTOR PACKAGE WITH SINGLE-SIDED SUBSTRATE AND METHOD FOR MAKING THE SAME

Patent #:	6620862	Issue Dt:	09/16/2003	Application #:	09851564	Filing Dt:	05/08/2001
Publication #:	US20020001688	Pub Dt:	01/03/2002
Title:	SHEET RESIN COMPOSITION

Patent #:	6686649	Issue Dt:	02/03/2004	Application #:	09855244	Filing Dt:	05/14/2001
Title:	MULTI-CHIP SEMICONDUCTOR PACKAGE WITH INTEGRAL SHIELD AND ANTENNA

Patent #:	6586677	Issue Dt:	07/01/2003	Application #:	09863359	Filing Dt:	05/22/2001
Publication #:	US20020027010	Pub Dt:	03/07/2002
Title:	PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE HAVING EXPOSED LEAD SURFACE

Patent #:	6670551	Issue Dt:	12/30/2003	Application #:	09871993	Filing Dt:	06/04/2001
Publication #:	US20020048842	Pub Dt:	04/25/2002
Title:	IMAGE SENSING COMPONENT PACKAGE AND MANUFACTURE METHOD THEREOF

Patent #:	6632997	Issue Dt:	10/14/2003	Application #:	09880277	Filing Dt:	06/13/2001
Publication #:	US20030000722	Pub Dt:	01/02/2003
Title:	PERSONALIZED CIRCUIT MODULE PACKAGE AND METHOD FOR PACKAGING CIRCUIT MODULES

Patent #:	6627987	Issue Dt:	09/30/2003	Application #:	09881343	Filing Dt:	06/13/2001
Title:	HERMETIC CERAMIC SEMICONDUCTOR PACKAGE

Patent #:	6586826	Issue Dt:	07/01/2003	Application #:	09881344	Filing Dt:	06/13/2001
Title:	INTEGRATED CIRCUIT PACKAGE HAVING POSTS FOR CONNECTION TO OTHER PACKAGES AND SUBSTRATES

Patent #:	6967124	Issue Dt:	11/22/2005	Application #:	09884193	Filing Dt:	06/19/2001
Title:	IMPRINTED INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR IMPRINTING AN INTEGRATED CIRCUIT SUBSTRATE

Patent #:	6660559	Issue Dt:	12/09/2003	Application #:	09888950	Filing Dt:	06/25/2001
Title:	METHOD OF MAKING A CHIP CARRIER PACKAGE USING LASER ABLATION

Patent #:	6765801	Issue Dt:	07/20/2004	Application #:	09891678	Filing Dt:	06/25/2001
Title:	OPTICAL TRACK DRAIN PACKAGE

Patent #:	6534338	Issue Dt:	03/18/2003	Application #:	09895767	Filing Dt:	06/29/2001
Title:	METHOD FOR MOLDING SEMICONDUCTOR PACKAGE HAVING A CERAMIC SUBSTRATE

Patent #:	6548759	Issue Dt:	04/15/2003	Application #:	09895994	Filing Dt:	06/28/2001
Title:	PRE-DRILLED IMAGE SENSOR PACKAGE

100

Patent #:	6661080	Issue Dt:	12/09/2003	Application #:	09895996	Filing Dt:	06/28/2001
Title:	STRUCTURE FOR BACKSIDE SAW CAVITY PROTECTION

Assignor

AMKOR TECHNOLOGY, INC.

Exec Dt:

11/19/2019

Assignee

AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.

491 B RIVER VALLEY ROAD

#15-02/04

VALLEY POINT, SINGAPORE 248373

Correspondence name and address
	MCANDREWS, HELD & MALLOY, LTD.
	500 WEST MADISON STREET
	34TH FLOOR
	CHICAGO, IL 60661

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