Patent Assignment Details
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Reel/Frame: | 022507/0136 | |
| Pages: | 2 |
| | Recorded: | 04/06/2009 | | |
Attorney Dkt #: | 018865-023000US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/21/2009
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Application #:
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11512941
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Filing Dt:
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08/29/2006
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Publication #:
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Pub Dt:
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03/06/2008
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Title:
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SEMICONDUCTOR DIE PACKAGE INCLUDING STACKED DICE AND HEAT SINK STRUCTURES
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Assignee
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82 RUNNING HILL ROAD |
SOUTH PORTLAND, MAINE 04106 |
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Correspondence name and address
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TOWNSEND AND TOWNSEND AND CREW LLP
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TWO EMBARCADERO CENTER
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EIGHTH FLOOR
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SAN FRANCISCO, CA 94111-3834
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