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Reel/Frame:	046683/0139			Pages:	67
		Recorded:	08/01/2018
Attorney Dkt #:	2068279-5062
Conveyance:	SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 1157
Page 5 of 12
Pages: 1 2 3 4 5 6 7 8 9 10 11 12

Patent #:	6946316	Issue Dt:	09/20/2005	Application #:	10286269	Filing Dt:	10/31/2002
Publication #:	US20030056967	Pub Dt:	03/27/2003
Title:	METHOD OF FABRICATING AND USING AN IMAGE SENSOR PACKAGE

Patent #:	6791076	Issue Dt:	09/14/2004	Application #:	10286589	Filing Dt:	10/31/2002
Publication #:	US20030057359	Pub Dt:	03/27/2003
Title:	IMAGE SENSOR PACKAGE

Patent #:	6905914	Issue Dt:	06/14/2005	Application #:	10291050	Filing Dt:	11/08/2002
Title:	WAFER LEVEL PACKAGE AND FABRICATION METHOD

Patent #:	6717248	Issue Dt:	04/06/2004	Application #:	10306627	Filing Dt:	11/26/2002
Publication #:	US20030100142	Pub Dt:	05/29/2003
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Patent #:	6987661	Issue Dt:	01/17/2006	Application #:	10319022	Filing Dt:	12/12/2002
Title:	INTEGRATED CIRCUIT SUBSTRATE HAVING EMBEDDED PASSIVE COMONENTS AND METHODS THEREFOR

Patent #:	6798047	Issue Dt:	09/28/2004	Application #:	10329620	Filing Dt:	12/26/2002
Title:	PRE-MOLDED LEADFRAME

Patent #:	6777789	Issue Dt:	08/17/2004	Application #:	10340256	Filing Dt:	01/10/2003
Title:	MOUNTING FOR A PACKAGE CONTAINING A CHIP

Patent #:	6833609	Issue Dt:	12/21/2004	Application #:	10354772	Filing Dt:	01/30/2003
Title:	INTEGRATED CIRCUIT DEVICE PACKAGES AND SUBSTRATES FOR MAKING THE PACKAGES

Patent #:	6723582	Issue Dt:	04/20/2004	Application #:	10356046	Filing Dt:	01/31/2003
Publication #:	US20030113954	Pub Dt:	06/19/2003
Title:	METHOD OF MAKING A SEMICONDUCTOR PACKAGE HAVING EXPOSED METAL STRAP

Patent #:	6965159	Issue Dt:	11/15/2005	Application #:	10356997	Filing Dt:	02/03/2003
Title:	REINFORCED LEAD-FRAME ASSEMBLY FOR INTERCONNECTING CIRCUITS WITHIN A CIRCUIT MODULE

Patent #:	6847099	Issue Dt:	01/25/2005	Application #:	10358621	Filing Dt:	02/05/2003
Title:	OFFSET ETCHED CORNER LEADS FOR SEMICONDUCTOR PACKAGE

Patent #:	6879047	Issue Dt:	04/12/2005	Application #:	10370013	Filing Dt:	02/19/2003
Title:	STACKING STRUCTURE FOR SEMICONDUCTOR DEVICES USING A FOLDED OVER FLEXIBLE SUBSTRATE AND METHOD THEREFOR

Patent #:	6750545	Issue Dt:	06/15/2004	Application #:	10376988	Filing Dt:	02/28/2003
Title:	SEMICONDUCTOR PACKAGE CAPABLE OF DIE STACKING

Patent #:	6927483	Issue Dt:	08/09/2005	Application #:	10383504	Filing Dt:	03/07/2003
Title:	SEMICONDUCTOR PACKAGE EXHIBITING EFFICIENT LEAD PLACEMENT

Patent #:	6794740	Issue Dt:	09/21/2004	Application #:	10387801	Filing Dt:	03/13/2003
Title:	LEADFRAME PACKAGE FOR SEMICONDUCTOR DEVICES

Patent #:	6930257	Issue Dt:	08/16/2005	Application #:	10392738	Filing Dt:	03/19/2003
Title:	INTEGRATED CIRCUIT SUBSTRATE HAVING LAMINATED LASER-EMBEDDED CIRCUIT LAYERS

Patent #:	6853060	Issue Dt:	02/08/2005	Application #:	10420977	Filing Dt:	04/22/2003
Title:	SEMICONDUCTOR PACKAGE USING A PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING THE SAME

Patent #:	6803254	Issue Dt:	10/12/2004	Application #:	10423702	Filing Dt:	04/25/2003
Publication #:	US20030199118	Pub Dt:	10/23/2003
Title:	WIRE BONDING METHOD FOR A SEMICONDUCTOR PACKAGE

Patent #:	6833619	Issue Dt:	12/21/2004	Application #:	10425134	Filing Dt:	04/28/2003
Title:	THIN PROFILE SEMICONDUCTOR PACKAGE WHICH REDUCES WARPAGE AND DAMAGE DURING LASER MARKINGS

Patent #:	7095103	Issue Dt:	08/22/2006	Application #:	10427117	Filing Dt:	05/01/2003
Title:	LEADFRAME BASED MEMORY CARD

Patent #:	6879034	Issue Dt:	04/12/2005	Application #:	10427118	Filing Dt:	05/01/2003
Title:	SEMICONDUCTOR PACKAGE INCLUDING LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE

Patent #:	6884695	Issue Dt:	04/26/2005	Application #:	10427610	Filing Dt:	04/30/2003
Publication #:	US20030207117	Pub Dt:	11/06/2003
Title:	SHEET RESIN COMPOSITION AND PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE THEREWITH

Patent #:	6822323	Issue Dt:	11/23/2004	Application #:	10435888	Filing Dt:	05/12/2003
Title:	SEMICONDUCTOR PACKAGE HAVING MORE RELIABLE ELECTRICAL CONDUCTIVE PATTERNS

Patent #:	6888242	Issue Dt:	05/03/2005	Application #:	10437749	Filing Dt:	05/14/2003
Publication #:	US20030219927	Pub Dt:	11/27/2003
Title:	COLOR CONTACTS FOR A SEMICONDUCTOR PACKAGE

Patent #:	7045396	Issue Dt:	05/16/2006	Application #:	10439671	Filing Dt:	05/16/2003
Publication #:	US20030197290	Pub Dt:	10/23/2003
Title:	STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

Patent #:	7008825	Issue Dt:	03/07/2006	Application #:	10445754	Filing Dt:	05/27/2003
Title:	LEADFRAME STRIP HAVING ENHANCED TESTABILITY

Patent #:	6876068	Issue Dt:	04/05/2005	Application #:	10447012	Filing Dt:	05/28/2003
Title:	SEMICONDUCTOR PACKAGE WITH INCREASED NUMBER OF INPUT AND OUTPUT PINS

Patent #:	6897550	Issue Dt:	05/24/2005	Application #:	10459097	Filing Dt:	06/11/2003
Title:	FULLY-MOLDED LEADFRAME STAND-OFF FEATURE

Patent #:	7183630	Issue Dt:	02/27/2007	Application #:	10459230	Filing Dt:	06/11/2003
Title:	LEAD FRAME WITH PLATED END LEADS

Patent #:	6982488	Issue Dt:	01/03/2006	Application #:	10600931	Filing Dt:	06/20/2003
Publication #:	US20040007771	Pub Dt:	01/15/2004
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Patent #:	6960828	Issue Dt:	11/01/2005	Application #:	10601938	Filing Dt:	06/23/2003
Publication #:	US20040053483	Pub Dt:	03/18/2004
Title:	ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS

Patent #:	7028400	Issue Dt:	04/18/2006	Application #:	10603878	Filing Dt:	06/24/2003
Title:	INTEGRATED CIRCUIT SUBSTRATE HAVING LASER-EXPOSED TERMINALS

Patent #:	7485952	Issue Dt:	02/03/2009	Application #:	10607324	Filing Dt:	06/26/2003
Title:	DROP RESISTANT BUMPERS FOR FULLY MOLDED MEMORY CARDS

Patent #:	6873032	Issue Dt:	03/29/2005	Application #:	10610016	Filing Dt:	06/30/2003
Title:	THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME

Patent #:	6911718	Issue Dt:	06/28/2005	Application #:	10614440	Filing Dt:	07/03/2003
Title:	DOUBLE DOWNSET DOUBLE DAMBAR SUSPENDED LEADFRAME

Patent #:	6873041	Issue Dt:	03/29/2005	Application #:	10618192	Filing Dt:	07/11/2003
Title:	POWER SEMICONDUCTOR PACKAGE WITH STRAP

Patent #:	7049682	Issue Dt:	05/23/2006	Application #:	10621780	Filing Dt:	07/16/2003
Title:	MULTI-CHIP SEMICONDUCTOR PACKAGE WITH INTEGRAL SHIELD AND ANTENNA

Patent #:	7102891	Issue Dt:	09/05/2006	Application #:	10625290	Filing Dt:	07/23/2003
Title:	CIRCUIT MODULE HAVING INTERCONNECTS FOR CONNECTING FUNCTIONING AND NON-FUNCTIONING ADD ONS AND METHOD THEREFOR

Patent #:	7071541	Issue Dt:	07/04/2006	Application #:	10626150	Filing Dt:	07/24/2003
Title:	PLASTIC INTEGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE

Patent #:	8258613	Issue Dt:	09/04/2012	Application #:	10634541	Filing Dt:	08/04/2003
Title:	SEMICONDUCTOR MEMORY CARD

Patent #:	8154111	Issue Dt:	04/10/2012	Application #:	10662248	Filing Dt:	09/15/2003
Publication #:	US20040056338	Pub Dt:	03/25/2004
Title:	NEAR CHIP SIZE SEMICONDUCTOR PACKAGE

Patent #:	7245007	Issue Dt:	07/17/2007	Application #:	10667226	Filing Dt:	09/18/2003
Title:	EXPOSED LEAD INTERPOSER LEADFRAME PACKAGE

Patent #:	7057280	Issue Dt:	06/06/2006	Application #:	10667227	Filing Dt:	09/18/2003
Publication #:	US20040097016	Pub Dt:	05/20/2004
Title:	LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT

Patent #:	6921967	Issue Dt:	07/26/2005	Application #:	10669820	Filing Dt:	09/24/2003
Publication #:	US20050062139	Pub Dt:	03/24/2005
Title:	REINFORCED DIE PAD SUPPORT STRUCTURE

Patent #:	6936922	Issue Dt:	08/30/2005	Application #:	10672886	Filing Dt:	09/26/2003
Title:	SEMICONDUCTOR PACKAGE STRUCTURE REDUCING WARPAGE AND MANUFACTURING METHOD THEREOF

Patent #:	6846704	Issue Dt:	01/25/2005	Application #:	10680280	Filing Dt:	10/07/2003
Publication #:	US20040065905	Pub Dt:	04/08/2004
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Patent #:	6998702	Issue Dt:	02/14/2006	Application #:	10680281	Filing Dt:	10/07/2003
Title:	FRONT EDGE CHAMFER FEATURE FOR FULLY-MOLDED MEMORY CARDS

Patent #:	6967395	Issue Dt:	11/22/2005	Application #:	10688138	Filing Dt:	10/17/2003
Title:	MOUNTING FOR A PACKAGE CONTAINING A CHIP

Patent #:	6893900	Issue Dt:	05/17/2005	Application #:	10688710	Filing Dt:	10/17/2003
Title:	METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE

Patent #:	7495326	Issue Dt:	02/24/2009	Application #:	10689976	Filing Dt:	10/21/2003
Publication #:	US20040124520	Pub Dt:	07/01/2004
Title:	STACKED ELECTRONIC STRUCTURES INCLUDING OFFSET SUBSTRATES

Patent #:	7138707	Issue Dt:	11/21/2006	Application #:	10690193	Filing Dt:	10/21/2003
Title:	Semiconductor package including leads and conductive posts for providing increased functionality

Patent #:	6977431	Issue Dt:	12/20/2005	Application #:	10702274	Filing Dt:	11/05/2003
Title:	STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Patent #:	7144517	Issue Dt:	12/05/2006	Application #:	10703301	Filing Dt:	11/07/2003
Title:	MANUFACTURING METHOD FOR LEADFRAME AND FOR SEMICONDUCTOR PACKAGE USING THE LEADFRAME

Patent #:	6930378	Issue Dt:	08/16/2005	Application #:	10705194	Filing Dt:	11/10/2003
Title:	STACKED SEMICONDUCTOR DIE ASSEMBLY HAVING AT LEAST ONE SUPPORT

Patent #:	7211879	Issue Dt:	05/01/2007	Application #:	10706468	Filing Dt:	11/12/2003
Title:	SEMICONDUCTOR PACKAGE WITH CHAMFERED CORNERS AND METHOD OF MANUFACTURING THE SAME

Patent #:	7091571	Issue Dt:	08/15/2006	Application #:	10735184	Filing Dt:	12/11/2003
Title:	IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURE THEREOF

Patent #:	6965157	Issue Dt:	11/15/2005	Application #:	10737572	Filing Dt:	12/16/2003
Title:	SEMICONDUCTOR PACKAGE WITH EXPOSED DIE PAD AND BODY-LOCKING LEADFRAME

Patent #:	7009296	Issue Dt:	03/07/2006	Application #:	10759990	Filing Dt:	01/15/2004
Title:	SEMICONDUCTOR PACKAGE WITH SUBSTRATE COUPLED TO A PERIPHERAL SIDE SURFACE OF A SEMICONDUCTOR DIE

Patent #:	7115445	Issue Dt:	10/03/2006	Application #:	10763859	Filing Dt:	01/23/2004
Publication #:	US20040150086	Pub Dt:	08/05/2004
Title:	SEMICONDUCTOR PACKAGE HAVING REDUCED THICKNESS

Patent #:	7057268	Issue Dt:	06/06/2006	Application #:	10765397	Filing Dt:	01/27/2004
Title:	CAVITY CASE WITH CLIP/PLUG FOR USE ON MULTI-MEDIA CARD

Patent #:	7091594	Issue Dt:	08/15/2006	Application #:	10766046	Filing Dt:	01/28/2004
Title:	LEADFRAME TYPE SEMICONDUCTOR PACKAGE HAVING REDUCED INDUCTANCE AND ITS MANUFACTURING METHOD

Patent #:	7633763	Issue Dt:	12/15/2009	Application #:	10766101	Filing Dt:	01/28/2004
Title:	DOUBLE MOLD MEMORY CARD AND ITS MANUFACTURING METHOD

Patent #:	6919631	Issue Dt:	07/19/2005	Application #:	10771072	Filing Dt:	02/02/2004
Title:	STRUCTURES FOR IMPROVING HEAT DISSIPATION IN STACKED SEMICONDUCTOR PACKAGES

Patent #:	7170150	Issue Dt:	01/30/2007	Application #:	10774893	Filing Dt:	02/09/2004
Publication #:	US20040159918	Pub Dt:	08/19/2004
Title:	LEAD FRAME FOR SEMICONDUCTOR PACKAGE

Patent #:	7081404	Issue Dt:	07/25/2006	Application #:	10780529	Filing Dt:	02/17/2004
Publication #:	US20040209406	Pub Dt:	10/21/2004
Title:	METHODS OF SELECTIVELY BUMPING INTEGRATED CIRCUIT SUBSTRATES AND RELATED STRUCTURES

Patent #:	6844615	Issue Dt:	01/18/2005	Application #:	10781220	Filing Dt:	02/18/2004
Title:	LEADFRAME PACKAGE FOR SEMICONDUCTOR DEVICES

Patent #:	7190071	Issue Dt:	03/13/2007	Application #:	10785528	Filing Dt:	02/24/2004
Publication #:	US20040164411	Pub Dt:	08/26/2004
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Patent #:	7156284	Issue Dt:	01/02/2007	Application #:	10790967	Filing Dt:	03/02/2004
Publication #:	US20040169064	Pub Dt:	09/02/2004
Title:	LOW TEMPERATURE METHODS OF BONDING COMPONENTS AND RELATED STRUCTURES

Patent #:	7061120	Issue Dt:	06/13/2006	Application #:	10803333	Filing Dt:	03/17/2004
Publication #:	US20040175916	Pub Dt:	09/09/2004
Title:	STACKABLE SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP WITHIN CENTRAL THROUGH HOLE OF SUBSTRATE

Patent #:	7185426	Issue Dt:	03/06/2007	Application #:	10806640	Filing Dt:	03/23/2004
Title:	METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

Patent #:	RE40112	Issue Dt:	02/26/2008	Application #:	10825670	Filing Dt:	04/14/2004
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Patent #:	7074654	Issue Dt:	07/11/2006	Application #:	10828616	Filing Dt:	04/21/2004
Title:	TAPE SUPPORTED MEMORY CARD LEADFRAME STRUCTURE

Patent #:	6946323	Issue Dt:	09/20/2005	Application #:	10831505	Filing Dt:	04/22/2004
Title:	SEMICONDUCTOR PACKAGE HAVING ONE OR MORE DIE STACKED ON A PREPACKAGED DEVICE AND METHOD THEREFOR

Patent #:	7665652	Issue Dt:	02/23/2010	Application #:	10837830	Filing Dt:	05/03/2004
Publication #:	US20040206801	Pub Dt:	10/21/2004
Title:	ELECTRONIC DEVICES INCLUDING METALLURGY STRUCTURES FOR WIRE AND SOLDER BONDING

Patent #:	7145238	Issue Dt:	12/05/2006	Application #:	10839647	Filing Dt:	05/05/2004
Title:	SEMICONDUCTOR PACKAGE AND SUBSTRATE HAVING MULTI-LEVEL VIAS

Patent #:	7005326	Issue Dt:	02/28/2006	Application #:	10847742	Filing Dt:	05/18/2004
Title:	METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE

Patent #:	7145253	Issue Dt:	12/05/2006	Application #:	10865096	Filing Dt:	06/09/2004
Title:	SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

Patent #:	7190062	Issue Dt:	03/13/2007	Application #:	10868244	Filing Dt:	06/15/2004
Title:	EMBEDDED LEADFRAME SEMICONDUCTOR PACKAGE

Patent #:	7067908	Issue Dt:	06/27/2006	Application #:	10868643	Filing Dt:	06/15/2004
Publication #:	US20040227217	Pub Dt:	11/18/2004
Title:	SEMICONDUCTOR PACKAGE HAVING IMPROVED ADHESIVENESS AND GROUND BONDING

Patent #:	7244671	Issue Dt:	07/17/2007	Application #:	10879411	Filing Dt:	06/29/2004
Publication #:	US20050020047	Pub Dt:	01/27/2005
Title:	METHODS OF FORMING CONDUCTIVE STRUCTURES INCLUDING TITANIUM-TUNGSTEN BASE LAYERS AND RELATED STRUCTURES

Patent #:	7211471	Issue Dt:	05/01/2007	Application #:	10881846	Filing Dt:	06/30/2004
Title:	EXPOSED LEAD QFP PACKAGE FABRICATED THROUGH THE USE OF A PARTIAL SAW PROCESS

Patent #:	6987314	Issue Dt:	01/17/2006	Application #:	10883593	Filing Dt:	06/30/2004
Title:	STACKABLE SEMICONDUCTOR PACKAGE WITH SOLDER ON PADS ON WHICH SECOND SEMICONDUCTOR PACKAGE IS STACKED

Patent #:	7030508	Issue Dt:	04/18/2006	Application #:	10884082	Filing Dt:	07/01/2004
Publication #:	US20050001299	Pub Dt:	01/06/2005
Title:	SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND WIRE BONDING METHOD USING THEREOF

Patent #:	7045893	Issue Dt:	05/16/2006	Application #:	10892625	Filing Dt:	07/15/2004
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Patent #:	7598598	Issue Dt:	10/06/2009	Application #:	10910089	Filing Dt:	08/03/2004
Title:	OFFSET ETCHED CORNER LEADS FOR SEMICONDUCTOR PACKAGE

Patent #:	7202554	Issue Dt:	04/10/2007	Application #:	10921642	Filing Dt:	08/19/2004
Title:	SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD

Patent #:	7102214	Issue Dt:	09/05/2006	Application #:	10923575	Filing Dt:	08/20/2004
Title:	PRE-MOLDED LEADFRAME

Patent #:	6956201	Issue Dt:	10/18/2005	Application #:	10928475	Filing Dt:	08/26/2004
Publication #:	US20050024752	Pub Dt:	02/03/2005
Title:	IMAGE SENSOR PACKAGE FABRICATION METHOD

Patent #:	6953988	Issue Dt:	10/11/2005	Application #:	10944241	Filing Dt:	09/17/2004
Publication #:	US20050062148	Pub Dt:	03/24/2005
Title:	SEMICONDUCTOR PACKAGE

Patent #:	7045882	Issue Dt:	05/16/2006	Application #:	10944314	Filing Dt:	09/17/2004
Publication #:	US20050029636	Pub Dt:	02/10/2005
Title:	SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP

Patent #:	7399661	Issue Dt:	07/15/2008	Application #:	10947124	Filing Dt:	09/22/2004
Publication #:	US20050041398	Pub Dt:	02/24/2005
Title:	METHOD FOR MAKING AN INTEGRATED CIRCUIT SUBSTRATE HAVING EMBEDDED BACK-SIDE ACCESS CONDUCTORS AND VIAS

Patent #:	7359579	Issue Dt:	04/15/2008	Application #:	10962221	Filing Dt:	10/08/2004
Title:	IMAGE SENSOR PACKAGE AND ITS MANUFACTURING METHOD

Patent #:	7049216	Issue Dt:	05/23/2006	Application #:	10965640	Filing Dt:	10/13/2004
Publication #:	US20050136641	Pub Dt:	06/23/2005
Title:	METHODS OF PROVIDING SOLDER STRUCTURES FOR OUT PLANE CONNECTIONS

Patent #:	7201327	Issue Dt:	04/10/2007	Application #:	10967462	Filing Dt:	10/18/2004
Title:	MEMORY CARD AND ITS MANUFACTURING METHOD

Patent #:	7217991	Issue Dt:	05/15/2007	Application #:	10971408	Filing Dt:	10/22/2004
Title:	FAN-IN LEADFRAME SEMICONDUCTOR PACKAGE

Patent #:	8072058	Issue Dt:	12/06/2011	Application #:	10972686	Filing Dt:	10/25/2004
Publication #:	US20090045499	Pub Dt:	02/19/2009
Title:	SEMICONDUCTOR PACKAGE HAVING A PLURALITY INPUT/OUTPUT MEMBERS

Patent #:	7193305	Issue Dt:	03/20/2007	Application #:	10980355	Filing Dt:	11/03/2004
Title:	MEMORY CARD ESC SUBSTRATE INSERT

Patent #:	7253503	Issue Dt:	08/07/2007	Application #:	10986634	Filing Dt:	11/12/2004
Title:	INTEGRATED CIRCUIT DEVICE PACKAGES AND SUBSTRATES FOR MAKING THE PACKAGES

Patent #:	7358600	Issue Dt:	04/15/2008	Application #:	10990265	Filing Dt:	11/16/2004
Title:	INTERPOSER FOR INTERCONNECTING COMPONENTS IN A MEMORY CARD

100

Patent #:	7071568	Issue Dt:	07/04/2006	Application #:	10991631	Filing Dt:	11/17/2004
Title:	STACKED-DIE EXTENSION SUPPORT STRUCTURE AND METHOD THEREOF

Assignor

AMKOR TECHNOLOGY, INC.

Exec Dt:

07/13/2018

Assignee

BANK OF AMERICA, N.A., AS AGENT

333 SOUTH HOPE STREET

19TH FLOOR

LOS ANGELES, CALIFORNIA 90071

Correspondence name and address
	MCGUIREWOODS LLP
	1750 TYSONS BOULEVARD
	SUITE 1800
	TYSONS, VA 22102

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