|
|
Patent #:
|
|
Issue Dt:
|
01/29/2013
|
Application #:
|
12548354
|
Filing Dt:
|
08/26/2009
|
Publication #:
|
|
Pub Dt:
|
03/03/2011
| | | | |
Title:
|
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
|
|
|
Patent #:
|
|
Issue Dt:
|
05/22/2012
|
Application #:
|
12549068
|
Filing Dt:
|
08/27/2009
|
Title:
|
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
07/12/2011
|
Application #:
|
12549083
|
Filing Dt:
|
08/27/2009
|
Title:
|
WAFER LEVEL CHIP SIZE PACKAGE HAVING REDISTRIBUTION LAYERS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/09/2011
|
Application #:
|
12555449
|
Filing Dt:
|
09/08/2009
|
Title:
|
BUMPED CHIP PACKAGE FABRICATION METHOD AND STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2013
|
Application #:
|
12562387
|
Filing Dt:
|
09/18/2009
|
Publication #:
|
|
Pub Dt:
|
03/24/2011
| | | | |
Title:
|
STACKABLE WAFER LEVEL PACKAGE AND FABRICATING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
10/08/2013
|
Application #:
|
12568041
|
Filing Dt:
|
09/28/2009
|
Title:
|
ROUTABLE SINGLE LAYER SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/30/2013
|
Application #:
|
12569300
|
Filing Dt:
|
09/29/2009
|
Title:
|
SHIELDED EMBEDDED ELECTRONIC COMPONENT SUBSTRATE FABRICATION METHOD AND STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2014
|
Application #:
|
12573466
|
Filing Dt:
|
10/05/2009
|
Title:
|
FAN OUT BUILD UP SUBSTRATE STACKABLE PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
09/23/2014
|
Application #:
|
12577064
|
Filing Dt:
|
10/09/2009
|
Title:
|
CONCENTRATED PHOTOVOLTAIC RECEIVER PACKAGE WITH BUILT-IN CONNECTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
01/29/2013
|
Application #:
|
12589500
|
Filing Dt:
|
10/23/2009
|
Title:
|
SHIELDED PACKAGE HAVING SHIELD LID
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2011
|
Application #:
|
12589839
|
Filing Dt:
|
10/28/2009
|
Title:
|
SEMICONDUCTOR PACKAGE INCLUDING A TOP-SURFACE METAL LAYER FOR IMPLEMENTING CIRCUIT FEATURES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2012
|
Application #:
|
12589868
|
Filing Dt:
|
10/28/2009
|
Title:
|
METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH ADHERING PORTION
|
|
|
Patent #:
|
|
Issue Dt:
|
10/21/2014
|
Application #:
|
12626512
|
Filing Dt:
|
11/25/2009
|
Title:
|
THROUGH WAFER VIA STRUCTURES FOR CONCENTRATED PHOTOVOLTAIC CELLS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/05/2013
|
Application #:
|
12627484
|
Filing Dt:
|
11/30/2009
|
Title:
|
BEND TEST METHOD AND APPARATUS FOR FLIP CHIP DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/20/2015
|
Application #:
|
12630586
|
Filing Dt:
|
12/03/2009
|
Title:
|
THIN STACKABLE PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
06/27/2017
|
Application #:
|
12632170
|
Filing Dt:
|
12/07/2009
|
Title:
|
METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2012
|
Application #:
|
12655724
|
Filing Dt:
|
01/05/2010
|
Title:
|
SEMICONDUCTOR PACKAGE INCLUDING TOP-SURFACE TERMINALS FOR MOUNTING ANOTHER SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2011
|
Application #:
|
12657425
|
Filing Dt:
|
01/20/2010
|
Title:
|
STACKED ELECTRONIC COMPONENT PACKAGE HAVING FILM-ON-WIRE SPACER
|
|
|
Patent #:
|
|
Issue Dt:
|
05/29/2012
|
Application #:
|
12661597
|
Filing Dt:
|
03/19/2010
|
Title:
|
DIRECT-WRITE WAFER LEVEL CHIP SCALE PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/26/2011
|
Application #:
|
12661604
|
Filing Dt:
|
03/19/2010
|
Title:
|
ELECTRONIC COMPONENT PACKAGE COMPRISING FAN-OUT TRACES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/05/2016
|
Application #:
|
12690741
|
Filing Dt:
|
01/20/2010
|
Title:
|
TRACE STACKING STRUCTURE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2013
|
Application #:
|
12692397
|
Filing Dt:
|
01/22/2010
|
Title:
|
FLEX CIRCUIT PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2012
|
Application #:
|
12692522
|
Filing Dt:
|
01/22/2010
|
Title:
|
EDGE MOUNT SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/03/2012
|
Application #:
|
12693372
|
Filing Dt:
|
01/25/2010
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING LEADFRAME WITH EXPOSED ANCHOR PADS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/18/2011
|
Application #:
|
12699739
|
Filing Dt:
|
02/03/2010
|
Title:
|
DUAL LAMINATE PACKAGE STRUCTURE WITH EMBEDDED ELEMENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2011
|
Application #:
|
12702505
|
Filing Dt:
|
02/09/2010
|
Title:
|
HEAT SPREADER PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
06/12/2012
|
Application #:
|
12708033
|
Filing Dt:
|
02/18/2010
|
Title:
|
TOP FEATURE PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
08/07/2012
|
Application #:
|
12708385
|
Filing Dt:
|
02/18/2010
|
Title:
|
POGO PIN INSERTING DEVICE FOR TESTING SEMICONDUCTOR DEVICES AND METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/2013
|
Application #:
|
12708432
|
Filing Dt:
|
02/18/2010
|
Title:
|
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE PADS TO PREVENT SOLDER REFLOW
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2013
|
Application #:
|
12727608
|
Filing Dt:
|
03/19/2010
|
Title:
|
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
01/29/2013
|
Application #:
|
12728119
|
Filing Dt:
|
03/19/2010
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2013
|
Application #:
|
12730062
|
Filing Dt:
|
03/23/2010
|
Title:
|
SEMICONDUCTOR PACKAGE THERMAL TAPE WINDOW FRAME FOR HEAT SINK ATTACHMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2012
|
Application #:
|
12751842
|
Filing Dt:
|
03/31/2010
|
Title:
|
SEMICONDUCTOR DEVICE FOR IMPROVING ELECTRICAL AND MECHANICAL CONNECTIVITY OF CONDUCTIVE PILLERS AND METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2012
|
Application #:
|
12754837
|
Filing Dt:
|
04/06/2010
|
Title:
|
THROUGH VIA NUB REVEAL METHOD AND STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2011
|
Application #:
|
12758583
|
Filing Dt:
|
04/12/2010
|
Title:
|
STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2015
|
Application #:
|
12779784
|
Filing Dt:
|
05/13/2010
|
Title:
|
SHIELDED ELECTRONIC COMPONENT PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2012
|
Application #:
|
12787238
|
Filing Dt:
|
05/25/2010
|
Title:
|
STACKABLE TREATED VIA PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2012
|
Application #:
|
12788845
|
Filing Dt:
|
05/27/2010
|
Title:
|
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2013
|
Application #:
|
12791472
|
Filing Dt:
|
06/01/2010
|
Title:
|
CONDUCTIVE POLYMER LID FOR A SENSOR PACKAGE AND METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
12/28/2010
|
Application #:
|
12798412
|
Filing Dt:
|
04/02/2010
|
Title:
|
SOLDER ATTACH FILM AND ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
07/19/2011
|
Application #:
|
12799751
|
Filing Dt:
|
04/30/2010
|
Title:
|
STACKABLE SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/18/2014
|
Application #:
|
12800757
|
Filing Dt:
|
05/21/2010
|
Title:
|
BLIND VIA CAPTURE PAD STRUCTURE FABRICATION METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
09/27/2011
|
Application #:
|
12802661
|
Filing Dt:
|
06/10/2010
|
Title:
|
SEMICONDUCTOR PACKAGE INCLUDING TOP-SURFACE TERMINALS FOR MOUNTING ANOTHER SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2016
|
Application #:
|
12815260
|
Filing Dt:
|
06/14/2010
|
Title:
|
CONCENTRATED PHOTOVOLTAIC RECEIVER MODULE WITH IMPROVED OPTICAL LIGHT GUIDE ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
08/13/2013
|
Application #:
|
12817923
|
Filing Dt:
|
06/17/2010
|
Title:
|
SYSTEM AND METHOD FOR LOWERING CONTACT RESISTANCE OF THE RADIO FREQUENCY (RF) SHIELD TO GROUND
|
|
|
Patent #:
|
|
Issue Dt:
|
12/27/2011
|
Application #:
|
12818446
|
Filing Dt:
|
06/18/2010
|
Title:
|
SEMICONDUCTOR PACKAGE WITH FAST POWER-UP CYCLE AND METHOD OF MAKING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/19/2014
|
Application #:
|
12830138
|
Filing Dt:
|
07/02/2010
|
Title:
|
MOLDED LIGHT GUIDE FOR CONCENTRATED PHOTOVOLTAIC RECEIVER MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2012
|
Application #:
|
12832202
|
Filing Dt:
|
07/08/2010
|
Title:
|
THIN STACKED INTERPOSER PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2016
|
Application #:
|
12834682
|
Filing Dt:
|
07/12/2010
|
Title:
|
TOP PORT MEMS MICROPHONE PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
12/25/2012
|
Application #:
|
12846973
|
Filing Dt:
|
07/30/2010
|
Title:
|
STACKABLE PLASMA CLEANED VIA PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
05/14/2013
|
Application #:
|
12848820
|
Filing Dt:
|
08/02/2010
|
Title:
|
THROUGH VIA CONNECTED BACKSIDE EMBEDDED CIRCUIT FEATURES STRUCTURE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
05/06/2014
|
Application #:
|
12848833
|
Filing Dt:
|
08/02/2010
|
Title:
|
FINGERPRINT SENSOR PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
10/08/2013
|
Application #:
|
12881905
|
Filing Dt:
|
09/14/2010
|
Title:
|
CONDUCTIVE PASTE AND MOLD FOR ELECTRICAL CONNECTION OF PHOTOVOLTAIC DIE TO SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/16/2013
|
Application #:
|
12898192
|
Filing Dt:
|
10/05/2010
|
Title:
|
SEMICONDUCTOR DEVICE HAVING THROUGH ELECTRODES PROTRUDING FROM DIELECTRIC LAYER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/16/2013
|
Application #:
|
12907430
|
Filing Dt:
|
10/19/2010
|
Publication #:
|
|
Pub Dt:
|
02/17/2011
| | | | |
Title:
|
ELECTRONIC STRUCTURES INCLUDING BARRIER LAYERS AND/OR OXIDATION BARRIERS DEFINING LIPS AND RELATED METHODS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2012
|
Application #:
|
12912490
|
Filing Dt:
|
10/26/2010
|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH INCREASED I/O
|
|
|
Patent #:
|
|
Issue Dt:
|
12/25/2012
|
Application #:
|
12913325
|
Filing Dt:
|
10/27/2010
|
Title:
|
MECHANICAL TAPE SEPARATION PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2015
|
Application #:
|
12913376
|
Filing Dt:
|
10/27/2010
|
Title:
|
LOW STRESS SUBSTRATE AND FORMATION METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
07/09/2013
|
Application #:
|
12917185
|
Filing Dt:
|
11/01/2010
|
Title:
|
STACKABLE PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
06/19/2012
|
Application #:
|
12924493
|
Filing Dt:
|
09/27/2010
|
Title:
|
STACKED REDISTRIBUTION LAYER (RDL) DIE ASSEMBLY PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/16/2015
|
Application #:
|
12924918
|
Filing Dt:
|
10/08/2010
|
Title:
|
SHIELDED TRACE STRUCTURE AND FABRICATION METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2012
|
Application #:
|
12927533
|
Filing Dt:
|
11/16/2010
|
Publication #:
|
|
Pub Dt:
|
04/21/2011
| | | | |
Title:
|
ADHESIVE ON WIRE STACKED SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2012
|
Application #:
|
12931325
|
Filing Dt:
|
01/27/2011
|
Title:
|
STACKABLE SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/26/2012
|
Application #:
|
12931326
|
Filing Dt:
|
01/27/2011
|
Title:
|
EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
08/29/2017
|
Application #:
|
12939588
|
Filing Dt:
|
11/04/2010
|
Title:
|
WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
09/03/2013
|
Application #:
|
12943540
|
Filing Dt:
|
11/10/2010
|
Title:
|
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/2013
|
Application #:
|
12945464
|
Filing Dt:
|
11/12/2010
|
Title:
|
ELECTRONIC ASSEMBLY HAVING INCREASED STANDOFF HEIGHT
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2014
|
Application #:
|
12955509
|
Filing Dt:
|
11/29/2010
|
Publication #:
|
|
Pub Dt:
|
05/31/2012
| | | | |
Title:
|
MAGNETIC FIELD SIMULATOR FOR TESTING SINGULATED OR MULTI-SITE STRIP SEMICONDUCTOR DEVICE AND METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
07/29/2014
|
Application #:
|
12959851
|
Filing Dt:
|
12/03/2010
|
Title:
|
INTEGRATED PASSIVE DEVICE STRUCTURE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
10/15/2013
|
Application #:
|
12959911
|
Filing Dt:
|
12/03/2010
|
Title:
|
SEMICONDUCTOR DEVICE HAVING OVERLAPPED VIA APERTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2012
|
Application #:
|
12963005
|
Filing Dt:
|
12/08/2010
|
Publication #:
|
|
Pub Dt:
|
04/14/2011
| | | | |
Title:
|
ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE LAYERS COMPRISING COPPER AND HAVING A THICKNESS OF AT LEAST 0.5 MICROMETERS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/18/2014
|
Application #:
|
12963431
|
Filing Dt:
|
12/08/2010
|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH DOWNSETS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2013
|
Application #:
|
12964397
|
Filing Dt:
|
12/09/2010
|
Title:
|
LIGHT EMITTING DIODE (LED) PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2012
|
Application #:
|
12964453
|
Filing Dt:
|
12/09/2010
|
Title:
|
DUAL LAMINATE PACKAGE STRUCTURE WITH EMBEDDED ELEMENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/06/2013
|
Application #:
|
12964468
|
Filing Dt:
|
12/09/2010
|
Title:
|
CONCENTRATED PHOTOVOLTAIC RECEIVER PACKAGE WITH STACKED INTERNAL SUPPORT FEATURES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/29/2012
|
Application #:
|
12965582
|
Filing Dt:
|
12/10/2010
|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME HAVING POWER BARS AND INCREASED I/O
|
|
|
Patent #:
|
|
Issue Dt:
|
02/04/2014
|
Application #:
|
12968794
|
Filing Dt:
|
12/15/2010
|
Publication #:
|
|
Pub Dt:
|
04/07/2011
| | | | |
Title:
|
WAFERS INCLUDING PATTERNED BACK SIDE LAYERS THEREON
|
|
|
Patent #:
|
|
Issue Dt:
|
03/05/2013
|
Application #:
|
12985888
|
Filing Dt:
|
01/06/2011
|
Title:
|
THROUGH VIA RECESSED REVEAL STRUCTURE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2012
|
Application #:
|
13009690
|
Filing Dt:
|
01/19/2011
|
Title:
|
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/11/2014
|
Application #:
|
13015071
|
Filing Dt:
|
01/27/2011
|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH A COMBINATION OF LEADS AND LANDS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/13/2015
|
Application #:
|
13015445
|
Filing Dt:
|
01/27/2011
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2013
|
Application #:
|
13016343
|
Filing Dt:
|
01/28/2011
|
Title:
|
TOP PORT WITH INTERPOSER MEMS MICROPHONE PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
12/30/2014
|
Application #:
|
13034517
|
Filing Dt:
|
02/24/2011
|
Title:
|
SEMICONDUCTOR DEVICE WITH MICRO ELECTROMECHANICAL SYSTEM DIE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/24/2012
|
Application #:
|
13036359
|
Filing Dt:
|
02/28/2011
|
Publication #:
|
|
Pub Dt:
|
06/16/2011
| | | | |
Title:
|
LEADFRAME FOR SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/21/2015
|
Application #:
|
13046071
|
Filing Dt:
|
03/11/2011
|
Title:
|
STACKED AND STAGGERED DIE MEMS PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2013
|
Application #:
|
13049647
|
Filing Dt:
|
03/16/2011
|
Title:
|
SEMICONDUCTOR DEVICE CAPABLE OF PREVENTING DIELECTRIC LAYER FROM CRACKING
|
|
|
Patent #:
|
|
Issue Dt:
|
02/21/2012
|
Application #:
|
13065296
|
Filing Dt:
|
03/18/2011
|
Title:
|
WAFER LEVEL PACKAGE FABRICATION METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
03/05/2013
|
Application #:
|
13065298
|
Filing Dt:
|
03/18/2011
|
Title:
|
FLIP CHIP BUMP STRUCTURE AND FABRICATION METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
02/26/2013
|
Application #:
|
13066137
|
Filing Dt:
|
04/06/2011
|
Title:
|
METAL ETCH STOP FABRICATION METHOD AND STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/20/2014
|
Application #:
|
13094728
|
Filing Dt:
|
04/26/2011
|
Title:
|
Semiconductor Package with Patterning layer and Method of Making Same
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2013
|
Application #:
|
13096359
|
Filing Dt:
|
04/28/2011
|
Title:
|
METAL MESH LID MEMS PACKAGE AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
05/20/2014
|
Application #:
|
13099680
|
Filing Dt:
|
05/03/2011
|
Title:
|
CONFORMAL SHIELD ON PUNCH QFN SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2013
|
Application #:
|
13100004
|
Filing Dt:
|
05/03/2011
|
Publication #:
|
|
Pub Dt:
|
08/25/2011
| | | | |
Title:
|
Micro-Optical Device Packaging System
|
|
|
Patent #:
|
|
Issue Dt:
|
05/14/2013
|
Application #:
|
13109845
|
Filing Dt:
|
05/17/2011
|
Title:
|
SIDE LEADED, BOTTOM EXPOSED PAD AND BOTTOM EXPOSED LEAD FUSION QUAD FLAT SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/11/2012
|
Application #:
|
13135070
|
Filing Dt:
|
06/23/2011
|
Title:
|
BUMPED CHIP PACKAGE FABRICATION METHOD AND STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/14/2013
|
Application #:
|
13135091
|
Filing Dt:
|
06/23/2011
|
Title:
|
HEAT SPREADER PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2012
|
Application #:
|
13136457
|
Filing Dt:
|
08/01/2011
|
Title:
|
SEMICONDUCTOR PACKAGE INCLUDING A TOP-SURFACE METAL LAYER FOR IMPLEMENTING CIRCUIT FEATURES
|
|
|
Patent #:
|
|
Issue Dt:
|
11/06/2012
|
Application #:
|
13151571
|
Filing Dt:
|
06/02/2011
|
Title:
|
FUSION QUAD FLAT SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/30/2013
|
Application #:
|
13161380
|
Filing Dt:
|
06/15/2011
|
Title:
|
INCREASED I/O LEADFRAME AND SEMICONDUCTOR DEVICE INCLUDING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2018
|
Application #:
|
13169385
|
Filing Dt:
|
06/27/2011
|
Title:
|
INTEGRATED SHIELD PACKAGE AND METHOD
|
|