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Patent Assignment Details
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Reel/Frame:004058/0139   Pages: 4
Recorded: 10/12/1982
Conveyance: LICENSE (SEE DOCUMENT FOR DETAILS).
Total properties: 9
1
Patent #:
Issue Dt:
12/16/1980
Application #:
05946592
Filing Dt:
09/28/1978
Title:
SEMICONDUCTOR OPTOELECTRONIC DEVICE PACKAGE
2
Patent #:
Issue Dt:
12/09/1980
Application #:
05951064
Filing Dt:
10/13/1978
Title:
METHOD OF CLEAVING SEMICONDUCTOR DIODE LASER WAFERS
3
Patent #:
Issue Dt:
12/02/1980
Application #:
05951074
Filing Dt:
10/13/1978
Title:
ETCH METHOD OF CLEAVING SEMICONDUCTOR DIODE LASER WAFERS
4
Patent #:
Issue Dt:
01/06/1981
Application #:
05972259
Filing Dt:
12/22/1978
Title:
MICROWAVE CURING OF PHOTORESIST FILMS
5
Patent #:
Issue Dt:
09/07/1982
Application #:
06060722
Filing Dt:
07/25/1979
Title:
TRANSIENT SUPPRESSION CIRCUIT
6
Patent #:
Issue Dt:
07/13/1982
Application #:
06064785
Filing Dt:
08/08/1979
Title:
DIODE LASER DIGITAL MODULATOR
7
Patent #:
Issue Dt:
09/07/1982
Application #:
06147047
Filing Dt:
05/05/1980
Title:
MOUNTING ARRANGEMENT FOR SEMICONDUCTOR OPTOELECTRONIC DEVICES
8
Patent #:
Issue Dt:
11/09/1982
Application #:
06189900
Filing Dt:
09/22/1980
Title:
HIGH SPEED EDGE ILLUMINATION PHOTODETECTOR
9
Patent #:
Issue Dt:
01/03/1984
Application #:
06288857
Filing Dt:
07/31/1981
Title:
BONDING PAD METALLIZATION FOR SEMICONDUCTOR DEVICES
Assignor
1
Exec Dt:
12/18/1981
Assignee
1
A NJ CORP.
NEW JERSEY
Correspondence name and address
EXXON RESEARCH & ENGINEERING CO.
P. O. BOX 390
FLORHAM PARK, N. J. 07932

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