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Patent Assignment Details
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Reel/Frame:011756/0144   Pages: 2
Recorded: 04/26/2001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/13/2003
Application #:
09746027
Filing Dt:
12/21/2000
Publication #:
Pub Dt:
09/20/2001
Title:
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE COMPRISING SEMICONDUCTOR ELEMENTS FORMED IN A TOPLAYER OF A SILICON WAFER SITUATED ON A BURIED INSULATING LAYER
Assignors
1
Exec Dt:
03/13/2001
2
Exec Dt:
03/14/2001
3
Exec Dt:
03/21/2001
4
Exec Dt:
03/27/2001
Assignee
1
1251 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10021
Correspondence name and address
U.S. PHILIPS CORPORATION
STEVEN R. BIREN
580 WHITE PLAINS ROAD
TARRYTOWN, NEW YORK 10591

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