Patent Assignment Details
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Reel/Frame: | 022390/0144 | |
| Pages: | 2 |
| | Recorded: | 03/12/2009 | | |
Attorney Dkt #: | MR1957-1472 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/14/2006
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Application #:
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10774427
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Filing Dt:
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02/10/2004
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Publication #:
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Pub Dt:
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08/11/2005
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Title:
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WAFER PACKAGING PROCESS OF PACKAGING LIGHT EMITTING DIODE
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Assignee
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5F, NO. 5, LANE 560, JHONGJHENG ROAD |
SINDIAN CITY, TAIPEI COUNTY, TAIWAN R.O.C. |
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Correspondence name and address
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ROSENBERG, KLEIN & LEE
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3458 ELLICOTT CENTER DRIVE-SUITE 101
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ELLICOTT CITY, MD 21043
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