Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 035508/0148 | |
| Pages: | 6 |
| | Recorded: | 04/27/2015 | | |
| Attorney Dkt #: | 1952.1376 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 035470 FRAME 0774. ASSIGNOR(S) HEREBY CONFIRMS THE SAMSUNG ELECTRO-MECHANICS CO., LTD.. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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14011159
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Filing Dt:
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08/27/2013
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Publication #:
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Pub Dt:
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02/27/2014
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Title:
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METHOD FOR FORMING SOLDER RESIST AND SUBSTRATE FOR PACKAGE
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Assignee
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| MAEYOUNG-RO 150 (MAETAN-DONG) |
| YOUNGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-743 |
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Correspondence name and address
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STAAS AND HALSEY LLP.
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1201 NEW YORK AVE
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7TH FLOOR
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WASHINGTON, DC 20005
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