Patent Assignment Details
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Reel/Frame: | 048033/0149 | |
| Pages: | 4 |
| | Recorded: | 01/16/2019 | | |
Attorney Dkt #: | 15304-000073-US-COA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/22/2019
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Application #:
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16249169
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Filing Dt:
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01/16/2019
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Publication #:
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Pub Dt:
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05/30/2019
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Title:
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PCB Module Having Multi-Sided Heat Sink Structure And Multilayer PCB Assembly For Use In Same
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Assignee
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(HORIM-DONG) #1-409, DAEGU MACHATRONICS&MATERIALS |
INSTITUTE,32, SEONGSEOGONGDAN-RO 11-GIL, DALSEO-GU |
DAEGU, KOREA, REPUBLIC OF 42714 |
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Correspondence name and address
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HARNESS DICKEY (ST. LOUIS)
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7700 BONHOMME, SUITE 400
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ST. LOUIS, MO 63105
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