Patent Assignment Details
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Reel/Frame: | 010640/0150 | |
| Pages: | 3 |
| | Recorded: | 02/25/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/23/2001
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Application #:
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09512381
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Filing Dt:
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02/25/2000
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Title:
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Polyimide for high temperature adhesive
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Assignee
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1, JOONGSAN-DONG KYONGSAN-SI |
KYONGSANGBUK-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARRISON & EGBERT
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JOHN S. EGBERT
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1018 PRESTON ST., SUITE 100
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HOUSTON, TEXAS 77002
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