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Patent Assignment Details
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Reel/Frame:030771/0150   Pages: 4
Recorded: 07/10/2013
Attorney Dkt #:093005C1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 4
1
Patent #:
Issue Dt:
06/21/2011
Application #:
12202342
Filing Dt:
09/01/2008
Publication #:
Pub Dt:
04/30/2009
Title:
CHIP STRUCTURE
2
Patent #:
Issue Dt:
04/05/2011
Application #:
12273546
Filing Dt:
11/19/2008
Publication #:
Pub Dt:
04/30/2009
Title:
OVER-PASSIVATION PROCESS OF FORMING POLYMER LAYER OVER IC CHIP
3
Patent #:
Issue Dt:
04/17/2012
Application #:
13098379
Filing Dt:
04/29/2011
Publication #:
Pub Dt:
08/25/2011
Title:
CHIP STRUCTURE
4
Patent #:
Issue Dt:
06/03/2014
Application #:
13271004
Filing Dt:
10/11/2011
Publication #:
Pub Dt:
02/02/2012
Title:
SOLDER INTERCONNECT ON IC CHIP
Assignor
1
Exec Dt:
04/28/2006
Assignee
1
ROOM 301/302, NO 47, PARK 2ND RD.
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN ROC
Correspondence name and address
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CA 92121-1714

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