Patent Assignment Details
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Reel/Frame: | 010627/0151 | |
| Pages: | 3 |
| | Recorded: | 03/14/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/06/2002
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Application #:
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09524952
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Filing Dt:
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03/14/2000
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Title:
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BALL GRID ARRAY INTEGRATED CIRCUIT PACKAGE WITH PALLADIUM COATED HEAT-DISSIPATION DEVICE
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Assignee
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TANTZU |
NO. 123, SEC. 3, DA FONG ROAD |
TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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DIKE, BRONSTEIN, ROBERTS & CUSHMAN, LLP
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PETER F. CORLESS
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130 WATER STREET
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BOSTON, MA 02109
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